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C70250 Copper vs. Solder Alloy 801

C70250 copper belongs to the copper alloys classification, while solder alloy 801 belongs to the otherwise unclassified metals. There are 22 material properties with values for both materials. Properties with values for just one material (4, in this case) are not shown.

For each property being compared, the top bar is C70250 copper and the bottom bar is solder alloy 801.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
53
Poisson's Ratio 0.34
0.35
Shear Modulus, GPa 44
20
Tensile Strength: Ultimate (UTS), MPa 520 to 740
55

Thermal Properties

Latent Heat of Fusion, J/g 220
64
Melting Completion (Liquidus), °C 1100
200
Melting Onset (Solidus), °C 1080
200
Specific Heat Capacity, J/kg-K 390
240
Thermal Conductivity, W/m-K 170
61
Thermal Expansion, µm/m-K 17
22

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 36 to 50
15
Electrical Conductivity: Equal Weight (Specific), % IACS 37 to 51
19

Otherwise Unclassified Properties

Density, g/cm3 8.9
7.2
Embodied Carbon, kg CO2/kg material 2.9
14
Embodied Energy, MJ/kg 45
240
Embodied Water, L/kg 310
1140

Common Calculations

Stiffness to Weight: Axial, points 7.4
4.1
Stiffness to Weight: Bending, points 18
17
Strength to Weight: Axial, points 16 to 23
2.1
Strength to Weight: Bending, points 16 to 21
4.4
Thermal Diffusivity, mm2/s 49
36
Thermal Shock Resistance, points 18 to 26
3.3

Alloy Composition

Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0
0 to 0.1
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.1
Cadmium (Cd), % 0
0 to 0.0020
Copper (Cu), % 92.7 to 97.5
0 to 0.050
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0
0 to 0.020
Lead (Pb), % 0 to 0.050
0 to 0.070
Magnesium (Mg), % 0.050 to 0.3
0
Manganese (Mn), % 0 to 0.1
0
Nickel (Ni), % 2.2 to 4.2
0 to 0.010
Silicon (Si), % 0.25 to 1.2
0
Silver (Ag), % 0
0 to 0.1
Tin (Sn), % 0
89.9 to 91.5
Zinc (Zn), % 0 to 1.0
8.5 to 9.5
Residuals, % 0 to 0.5
0