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C70260 Copper vs. CC382H Copper-nickel

Both C70260 copper and CC382H copper-nickel are copper alloys. They have 68% of their average alloy composition in common. There are 28 material properties with values for both materials. Properties with values for just one material (2, in this case) are not shown.

For each property being compared, the top bar is C70260 copper and the bottom bar is CC382H copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
140
Elongation at Break, % 9.5 to 19
20
Poisson's Ratio 0.34
0.33
Shear Modulus, GPa 44
53
Tensile Strength: Ultimate (UTS), MPa 520 to 760
490
Tensile Strength: Yield (Proof), MPa 410 to 650
290

Thermal Properties

Latent Heat of Fusion, J/g 220
240
Maximum Temperature: Mechanical, °C 200
260
Melting Completion (Liquidus), °C 1060
1180
Melting Onset (Solidus), °C 1040
1120
Specific Heat Capacity, J/kg-K 390
410
Thermal Conductivity, W/m-K 160
30
Thermal Expansion, µm/m-K 17
15

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 40 to 50
5.5
Electrical Conductivity: Equal Weight (Specific), % IACS 40 to 51
5.6

Otherwise Unclassified Properties

Base Metal Price, % relative 31
41
Density, g/cm3 8.9
8.9
Embodied Carbon, kg CO2/kg material 2.7
5.2
Embodied Energy, MJ/kg 43
76
Embodied Water, L/kg 310
290

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 46 to 140
85
Resilience: Unit (Modulus of Resilience), kJ/m3 710 to 1810
290
Stiffness to Weight: Axial, points 7.3
8.8
Stiffness to Weight: Bending, points 18
20
Strength to Weight: Axial, points 16 to 24
15
Strength to Weight: Bending, points 16 to 21
16
Thermal Diffusivity, mm2/s 45
8.2
Thermal Shock Resistance, points 18 to 27
16

Alloy Composition

Aluminum (Al), % 0
0 to 0.010
Bismuth (Bi), % 0
0 to 0.0020
Boron (B), % 0
0 to 0.010
Carbon (C), % 0
0 to 0.030
Chromium (Cr), % 0
1.5 to 2.0
Copper (Cu), % 95.8 to 98.8
62.8 to 68.4
Iron (Fe), % 0
0.5 to 1.0
Lead (Pb), % 0
0 to 0.0050
Magnesium (Mg), % 0
0 to 0.010
Manganese (Mn), % 0
0.5 to 1.0
Nickel (Ni), % 1.0 to 3.0
29 to 32
Phosphorus (P), % 0 to 0.010
0 to 0.010
Selenium (Se), % 0
0 to 0.0050
Silicon (Si), % 0.2 to 0.7
0.15 to 0.5
Sulfur (S), % 0
0 to 0.010
Tellurium (Te), % 0
0 to 0.0050
Titanium (Ti), % 0
0 to 0.25
Zinc (Zn), % 0
0 to 0.2
Zirconium (Zr), % 0
0 to 0.15
Residuals, % 0 to 0.5
0