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C70260 Copper vs. S32205 Stainless Steel

C70260 copper belongs to the copper alloys classification, while S32205 stainless steel belongs to the iron alloys. There are 29 material properties with values for both materials. Properties with values for just one material (6, in this case) are not shown.

For each property being compared, the top bar is C70260 copper and the bottom bar is S32205 stainless steel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
200
Elongation at Break, % 9.5 to 19
28
Poisson's Ratio 0.34
0.27
Shear Modulus, GPa 44
80
Shear Strength, MPa 320 to 450
480
Tensile Strength: Ultimate (UTS), MPa 520 to 760
740
Tensile Strength: Yield (Proof), MPa 410 to 650
510

Thermal Properties

Latent Heat of Fusion, J/g 220
300
Maximum Temperature: Mechanical, °C 200
1070
Melting Completion (Liquidus), °C 1060
1450
Melting Onset (Solidus), °C 1040
1400
Specific Heat Capacity, J/kg-K 390
480
Thermal Conductivity, W/m-K 160
15
Thermal Expansion, µm/m-K 17
13

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 40 to 50
2.2
Electrical Conductivity: Equal Weight (Specific), % IACS 40 to 51
2.5

Otherwise Unclassified Properties

Base Metal Price, % relative 31
18
Density, g/cm3 8.9
7.8
Embodied Carbon, kg CO2/kg material 2.7
3.7
Embodied Energy, MJ/kg 43
50
Embodied Water, L/kg 310
160

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 46 to 140
190
Resilience: Unit (Modulus of Resilience), kJ/m3 710 to 1810
630
Stiffness to Weight: Axial, points 7.3
14
Stiffness to Weight: Bending, points 18
25
Strength to Weight: Axial, points 16 to 24
26
Strength to Weight: Bending, points 16 to 21
23
Thermal Diffusivity, mm2/s 45
4.0
Thermal Shock Resistance, points 18 to 27
20

Alloy Composition

Carbon (C), % 0
0 to 0.030
Chromium (Cr), % 0
22 to 23
Copper (Cu), % 95.8 to 98.8
0
Iron (Fe), % 0
63.7 to 70.4
Manganese (Mn), % 0
0 to 2.0
Molybdenum (Mo), % 0
3.0 to 3.5
Nickel (Ni), % 1.0 to 3.0
4.5 to 6.5
Nitrogen (N), % 0
0.14 to 0.2
Phosphorus (P), % 0 to 0.010
0 to 0.030
Silicon (Si), % 0.2 to 0.7
0 to 1.0
Sulfur (S), % 0
0 to 0.020
Residuals, % 0 to 0.5
0