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C70400 Copper-nickel vs. Solder Alloy 116

C70400 copper-nickel belongs to the copper alloys classification, while solder alloy 116 belongs to the otherwise unclassified metals. There are 23 material properties with values for both materials. Properties with values for just one material (5, in this case) are not shown.

For each property being compared, the top bar is C70400 copper-nickel and the bottom bar is solder alloy 116.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
26
Poisson's Ratio 0.34
0.42
Shear Modulus, GPa 45
9.3
Tensile Strength: Ultimate (UTS), MPa 300 to 310
34

Thermal Properties

Latent Heat of Fusion, J/g 210
34
Melting Completion (Liquidus), °C 1120
260
Melting Onset (Solidus), °C 1060
180
Specific Heat Capacity, J/kg-K 390
160
Thermal Conductivity, W/m-K 64
41
Thermal Expansion, µm/m-K 17
27

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 14
9.3
Electrical Conductivity: Equal Weight (Specific), % IACS 14
8.3

Otherwise Unclassified Properties

Base Metal Price, % relative 32
90
Density, g/cm3 8.9
10
Embodied Carbon, kg CO2/kg material 3.0
7.2
Embodied Energy, MJ/kg 47
120
Embodied Water, L/kg 300
690

Common Calculations

Stiffness to Weight: Axial, points 7.5
1.5
Stiffness to Weight: Bending, points 19
9.8
Strength to Weight: Axial, points 9.3 to 9.8
0.94
Strength to Weight: Bending, points 11 to 12
2.3
Thermal Diffusivity, mm2/s 18
26
Thermal Shock Resistance, points 10 to 11
3.4

Alloy Composition

Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0
0 to 0.5
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.25
Cadmium (Cd), % 0
0 to 0.0050
Copper (Cu), % 89.8 to 93.6
0 to 0.080
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 1.3 to 1.7
0 to 0.020
Lead (Pb), % 0 to 0.050
68.4 to 70.5
Manganese (Mn), % 0.3 to 0.8
0
Nickel (Ni), % 4.8 to 6.2
0 to 0.010
Silver (Ag), % 0
0 to 0.1
Tin (Sn), % 0
29.5 to 30.5
Zinc (Zn), % 0 to 1.0
0 to 0.0010
Residuals, % 0 to 0.5
0