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C70600 Copper-nickel vs. Solder Alloy 123

C70600 copper-nickel belongs to the copper alloys classification, while solder alloy 123 belongs to the otherwise unclassified metals. There are 24 material properties with values for both materials. Properties with values for just one material (7, in this case) are not shown.

For each property being compared, the top bar is C70600 copper-nickel and the bottom bar is solder alloy 123.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
18
Elongation at Break, % 3.0 to 34
45
Poisson's Ratio 0.34
0.44
Shear Modulus, GPa 46
6.2
Tensile Strength: Ultimate (UTS), MPa 290 to 570
28

Thermal Properties

Latent Heat of Fusion, J/g 220
26
Melting Completion (Liquidus), °C 1150
310
Melting Onset (Solidus), °C 1100
300
Specific Heat Capacity, J/kg-K 390
130
Thermal Conductivity, W/m-K 44
23
Thermal Expansion, µm/m-K 17
29

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 9.8
8.8
Electrical Conductivity: Equal Weight (Specific), % IACS 9.9
7.1

Otherwise Unclassified Properties

Base Metal Price, % relative 33
75
Density, g/cm3 8.9
11
Embodied Carbon, kg CO2/kg material 3.4
4.5
Embodied Energy, MJ/kg 51
74
Embodied Water, L/kg 300
500

Common Calculations

Stiffness to Weight: Axial, points 7.7
0.9
Stiffness to Weight: Bending, points 19
7.8
Strength to Weight: Axial, points 9.1 to 18
0.69
Strength to Weight: Bending, points 11 to 17
1.8
Thermal Diffusivity, mm2/s 13
16
Thermal Shock Resistance, points 9.8 to 19
3.8

Alloy Composition

Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0
0 to 0.5
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.1
Cadmium (Cd), % 0
0 to 0.0050
Copper (Cu), % 84.7 to 90
0 to 0.080
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 1.0 to 1.8
0 to 0.020
Lead (Pb), % 0 to 0.050
93.5 to 95.5
Manganese (Mn), % 0 to 1.0
0
Nickel (Ni), % 9.0 to 11
0 to 0.010
Silver (Ag), % 0
0 to 0.1
Tin (Sn), % 0
4.5 to 5.5
Zinc (Zn), % 0 to 1.0
0 to 0.0010
Residuals, % 0 to 0.5
0