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C70600 Copper-nickel vs. Solder Alloy 811

C70600 copper-nickel belongs to the copper alloys classification, while solder alloy 811 belongs to the otherwise unclassified metals. There are 23 material properties with values for both materials. Properties with values for just one material (7, in this case) are not shown.

For each property being compared, the top bar is C70600 copper-nickel and the bottom bar is solder alloy 811.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
52
Elongation at Break, % 3.0 to 34
38
Poisson's Ratio 0.34
0.35
Shear Modulus, GPa 46
19
Tensile Strength: Ultimate (UTS), MPa 290 to 570
53

Thermal Properties

Latent Heat of Fusion, J/g 220
63
Melting Completion (Liquidus), °C 1150
200
Melting Onset (Solidus), °C 1100
190
Specific Heat Capacity, J/kg-K 390
230
Thermal Conductivity, W/m-K 44
59
Thermal Expansion, µm/m-K 17
22

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 9.8
14
Electrical Conductivity: Equal Weight (Specific), % IACS 9.9
17

Otherwise Unclassified Properties

Density, g/cm3 8.9
7.3
Embodied Carbon, kg CO2/kg material 3.4
14
Embodied Energy, MJ/kg 51
240
Embodied Water, L/kg 300
1200

Common Calculations

Stiffness to Weight: Axial, points 7.7
4.0
Stiffness to Weight: Bending, points 19
17
Strength to Weight: Axial, points 9.1 to 18
2.0
Strength to Weight: Bending, points 11 to 17
4.3
Thermal Diffusivity, mm2/s 13
35
Thermal Shock Resistance, points 9.8 to 19
3.3

Alloy Composition

Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0
0 to 0.1
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
2.8 to 3.2
Cadmium (Cd), % 0
0 to 0.0020
Copper (Cu), % 84.7 to 90
0 to 0.050
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 1.0 to 1.8
0 to 0.020
Lead (Pb), % 0 to 0.050
0 to 0.070
Manganese (Mn), % 0 to 1.0
0
Nickel (Ni), % 9.0 to 11
0 to 0.010
Silver (Ag), % 0
0 to 0.1
Tin (Sn), % 0
87.8 to 89.7
Zinc (Zn), % 0 to 1.0
7.5 to 8.5
Residuals, % 0 to 0.5
0