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C70620 Copper-nickel vs. Solder Alloy 503

C70620 copper-nickel belongs to the copper alloys classification, while solder alloy 503 belongs to the otherwise unclassified metals. There are 19 material properties with values for both materials. Properties with values for just one material (8, in this case) are not shown.

For each property being compared, the top bar is C70620 copper-nickel and the bottom bar is solder alloy 503.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
54
Poisson's Ratio 0.34
0.36
Shear Modulus, GPa 46
20
Tensile Strength: Ultimate (UTS), MPa 300 to 570
57

Thermal Properties

Latent Heat of Fusion, J/g 220
69
Melting Completion (Liquidus), °C 1120
380
Melting Onset (Solidus), °C 1060
220
Specific Heat Capacity, J/kg-K 390
230
Thermal Conductivity, W/m-K 49
61
Thermal Expansion, µm/m-K 17
22

Otherwise Unclassified Properties

Density, g/cm3 8.9
7.5
Embodied Carbon, kg CO2/kg material 3.4
16
Embodied Energy, MJ/kg 51
270

Common Calculations

Stiffness to Weight: Axial, points 7.7
4.1
Stiffness to Weight: Bending, points 19
17
Strength to Weight: Axial, points 9.3 to 18
2.1
Strength to Weight: Bending, points 11 to 17
4.4
Thermal Diffusivity, mm2/s 14
35
Thermal Shock Resistance, points 10 to 20
3.5

Alloy Composition

Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0
0 to 0.1
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.080
Cadmium (Cd), % 0
0 to 0.0020
Carbon (C), % 0 to 0.050
0
Copper (Cu), % 86.5 to 90
5.5 to 6.5
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 1.0 to 1.8
0 to 0.020
Lead (Pb), % 0 to 0.020
0 to 0.070
Manganese (Mn), % 0 to 1.0
0
Nickel (Ni), % 9.0 to 11
0 to 0.010
Phosphorus (P), % 0 to 0.2
0
Silver (Ag), % 0
1.8 to 2.2
Sulfur (S), % 0 to 0.020
0
Tin (Sn), % 0
90.8 to 92.7
Zinc (Zn), % 0 to 0.5
0 to 0.0010
Residuals, % 0 to 0.5
0