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C70620 Copper-nickel vs. Solder Alloy 601

C70620 copper-nickel belongs to the copper alloys classification, while solder alloy 601 belongs to the otherwise unclassified metals. There are 18 material properties with values for both materials. Properties with values for just one material (10, in this case) are not shown.

For each property being compared, the top bar is C70620 copper-nickel and the bottom bar is solder alloy 601.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
31
Poisson's Ratio 0.34
0.41
Shear Modulus, GPa 46
11
Tensile Strength: Ultimate (UTS), MPa 300 to 570
12

Thermal Properties

Latent Heat of Fusion, J/g 220
43
Melting Completion (Liquidus), °C 1120
120
Melting Onset (Solidus), °C 1060
120
Specific Heat Capacity, J/kg-K 390
230
Thermal Conductivity, W/m-K 49
34
Thermal Expansion, µm/m-K 17
23

Otherwise Unclassified Properties

Density, g/cm3 8.9
7.3
Embodied Water, L/kg 300
1330

Common Calculations

Stiffness to Weight: Axial, points 7.7
2.3
Stiffness to Weight: Bending, points 19
14
Strength to Weight: Axial, points 9.3 to 18
0.45
Strength to Weight: Bending, points 11 to 17
1.6
Thermal Diffusivity, mm2/s 14
20
Thermal Shock Resistance, points 10 to 20
1.2

Alloy Composition

Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0
0 to 0.1
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.1
Cadmium (Cd), % 0
0 to 0.0020
Carbon (C), % 0 to 0.050
0
Copper (Cu), % 86.5 to 90
0 to 0.050
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
51 to 52.5
Iron (Fe), % 1.0 to 1.8
0 to 0.020
Lead (Pb), % 0 to 0.020
0 to 0.070
Manganese (Mn), % 0 to 1.0
0
Nickel (Ni), % 9.0 to 11
0 to 0.010
Phosphorus (P), % 0 to 0.2
0
Silver (Ag), % 0
0 to 0.1
Sulfur (S), % 0 to 0.020
0
Tin (Sn), % 0
47.5 to 48.5
Zinc (Zn), % 0 to 0.5
0 to 0.0010
Residuals, % 0 to 0.5
0