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C70700 Copper-nickel vs. EN 1.1127 Steel

C70700 copper-nickel belongs to the copper alloys classification, while EN 1.1127 steel belongs to the iron alloys. There are 30 material properties with values for both materials. Properties with values for just one material (1, in this case) are not shown.

For each property being compared, the top bar is C70700 copper-nickel and the bottom bar is EN 1.1127 steel.

Metric UnitsUS Customary Units

Mechanical Properties

Brinell Hardness 73
190 to 230
Elastic (Young's, Tensile) Modulus, GPa 120
190
Elongation at Break, % 39
14 to 25
Poisson's Ratio 0.34
0.29
Shear Modulus, GPa 46
73
Shear Strength, MPa 220
420 to 480
Tensile Strength: Ultimate (UTS), MPa 320
660 to 790
Tensile Strength: Yield (Proof), MPa 110
410 to 580

Thermal Properties

Latent Heat of Fusion, J/g 220
250
Maximum Temperature: Mechanical, °C 220
400
Melting Completion (Liquidus), °C 1120
1460
Melting Onset (Solidus), °C 1060
1410
Specific Heat Capacity, J/kg-K 390
470
Thermal Conductivity, W/m-K 59
49
Thermal Expansion, µm/m-K 16
12

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 11
7.3
Electrical Conductivity: Equal Weight (Specific), % IACS 12
8.4

Otherwise Unclassified Properties

Base Metal Price, % relative 34
2.1
Density, g/cm3 8.9
7.8
Embodied Carbon, kg CO2/kg material 3.4
1.5
Embodied Energy, MJ/kg 52
19
Embodied Water, L/kg 300
49

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 100
90 to 140
Resilience: Unit (Modulus of Resilience), kJ/m3 51
440 to 880
Stiffness to Weight: Axial, points 7.6
13
Stiffness to Weight: Bending, points 19
24
Strength to Weight: Axial, points 10
23 to 28
Strength to Weight: Bending, points 12
22 to 24
Thermal Diffusivity, mm2/s 17
13
Thermal Shock Resistance, points 12
21 to 25

Alloy Composition

Carbon (C), % 0
0.34 to 0.42
Chromium (Cr), % 0
0 to 0.4
Copper (Cu), % 88.5 to 90.5
0
Iron (Fe), % 0 to 0.050
96.6 to 98.1
Manganese (Mn), % 0 to 0.5
1.4 to 1.7
Molybdenum (Mo), % 0
0 to 0.1
Nickel (Ni), % 9.5 to 10.5
0 to 0.4
Phosphorus (P), % 0
0 to 0.035
Silicon (Si), % 0
0.15 to 0.35
Sulfur (S), % 0
0 to 0.035
Residuals, % 0 to 0.5
0