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C70700 Copper-nickel vs. EN 1.4122 Stainless Steel

C70700 copper-nickel belongs to the copper alloys classification, while EN 1.4122 stainless steel belongs to the iron alloys. There are 29 material properties with values for both materials. Properties with values for just one material (4, in this case) are not shown.

For each property being compared, the top bar is C70700 copper-nickel and the bottom bar is EN 1.4122 stainless steel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
200
Elongation at Break, % 39
14
Poisson's Ratio 0.34
0.28
Shear Modulus, GPa 46
77
Shear Strength, MPa 220
480 to 520
Tensile Strength: Ultimate (UTS), MPa 320
790 to 850
Tensile Strength: Yield (Proof), MPa 110
450 to 630

Thermal Properties

Latent Heat of Fusion, J/g 220
280
Maximum Temperature: Mechanical, °C 220
870
Melting Completion (Liquidus), °C 1120
1440
Melting Onset (Solidus), °C 1060
1400
Specific Heat Capacity, J/kg-K 390
480
Thermal Conductivity, W/m-K 59
15
Thermal Expansion, µm/m-K 16
10

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 11
2.2
Electrical Conductivity: Equal Weight (Specific), % IACS 12
2.5

Otherwise Unclassified Properties

Base Metal Price, % relative 34
9.5
Density, g/cm3 8.9
7.7
Embodied Carbon, kg CO2/kg material 3.4
2.4
Embodied Energy, MJ/kg 52
33
Embodied Water, L/kg 300
120

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 100
93 to 110
Resilience: Unit (Modulus of Resilience), kJ/m3 51
520 to 1000
Stiffness to Weight: Axial, points 7.6
14
Stiffness to Weight: Bending, points 19
25
Strength to Weight: Axial, points 10
28 to 31
Strength to Weight: Bending, points 12
25 to 26
Thermal Diffusivity, mm2/s 17
4.0
Thermal Shock Resistance, points 12
28 to 30

Alloy Composition

Carbon (C), % 0
0.33 to 0.45
Chromium (Cr), % 0
15.5 to 17.5
Copper (Cu), % 88.5 to 90.5
0
Iron (Fe), % 0 to 0.050
77.2 to 83.4
Manganese (Mn), % 0 to 0.5
0 to 1.5
Molybdenum (Mo), % 0
0.8 to 1.3
Nickel (Ni), % 9.5 to 10.5
0 to 1.0
Phosphorus (P), % 0
0 to 0.040
Silicon (Si), % 0
0 to 1.0
Sulfur (S), % 0
0 to 0.015
Residuals, % 0 to 0.5
0