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C70700 Copper-nickel vs. EN 1.4630 Stainless Steel

C70700 copper-nickel belongs to the copper alloys classification, while EN 1.4630 stainless steel belongs to the iron alloys. There are 29 material properties with values for both materials. Properties with values for just one material (4, in this case) are not shown.

For each property being compared, the top bar is C70700 copper-nickel and the bottom bar is EN 1.4630 stainless steel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
190
Elongation at Break, % 39
23
Poisson's Ratio 0.34
0.28
Shear Modulus, GPa 46
76
Shear Strength, MPa 220
300
Tensile Strength: Ultimate (UTS), MPa 320
480
Tensile Strength: Yield (Proof), MPa 110
250

Thermal Properties

Latent Heat of Fusion, J/g 220
290
Maximum Temperature: Mechanical, °C 220
800
Melting Completion (Liquidus), °C 1120
1440
Melting Onset (Solidus), °C 1060
1390
Specific Heat Capacity, J/kg-K 390
480
Thermal Conductivity, W/m-K 59
28
Thermal Expansion, µm/m-K 16
10

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 11
2.8
Electrical Conductivity: Equal Weight (Specific), % IACS 12
3.3

Otherwise Unclassified Properties

Base Metal Price, % relative 34
9.5
Density, g/cm3 8.9
7.7
Embodied Carbon, kg CO2/kg material 3.4
2.5
Embodied Energy, MJ/kg 52
36
Embodied Water, L/kg 300
120

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 100
92
Resilience: Unit (Modulus of Resilience), kJ/m3 51
160
Stiffness to Weight: Axial, points 7.6
14
Stiffness to Weight: Bending, points 19
25
Strength to Weight: Axial, points 10
17
Strength to Weight: Bending, points 12
18
Thermal Diffusivity, mm2/s 17
7.5
Thermal Shock Resistance, points 12
17

Alloy Composition

Aluminum (Al), % 0
0 to 1.5
Carbon (C), % 0
0 to 0.030
Chromium (Cr), % 0
13 to 16
Copper (Cu), % 88.5 to 90.5
0 to 0.5
Iron (Fe), % 0 to 0.050
77.1 to 86.7
Manganese (Mn), % 0 to 0.5
0 to 1.0
Molybdenum (Mo), % 0
0 to 0.5
Nickel (Ni), % 9.5 to 10.5
0 to 0.5
Niobium (Nb), % 0
0 to 0.5
Phosphorus (P), % 0
0 to 0.050
Silicon (Si), % 0
0.2 to 1.5
Sulfur (S), % 0
0 to 0.050
Titanium (Ti), % 0
0.15 to 0.8
Residuals, % 0 to 0.5
0