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C70700 Copper-nickel vs. Solder Alloy 112

C70700 copper-nickel belongs to the copper alloys classification, while solder alloy 112 belongs to the otherwise unclassified metals. There are 23 material properties with values for both materials. Properties with values for just one material (7, in this case) are not shown.

For each property being compared, the top bar is C70700 copper-nickel and the bottom bar is solder alloy 112.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
33
Elongation at Break, % 39
35
Poisson's Ratio 0.34
0.4
Shear Modulus, GPa 46
12
Tensile Strength: Ultimate (UTS), MPa 320
41

Thermal Properties

Latent Heat of Fusion, J/g 220
41
Melting Completion (Liquidus), °C 1120
220
Melting Onset (Solidus), °C 1060
180
Specific Heat Capacity, J/kg-K 390
180
Thermal Conductivity, W/m-K 59
49
Thermal Expansion, µm/m-K 16
26

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 11
11
Electrical Conductivity: Equal Weight (Specific), % IACS 12
10

Otherwise Unclassified Properties

Density, g/cm3 8.9
9.3
Embodied Carbon, kg CO2/kg material 3.4
9.4
Embodied Energy, MJ/kg 52
160
Embodied Water, L/kg 300
830

Common Calculations

Stiffness to Weight: Axial, points 7.6
2.0
Stiffness to Weight: Bending, points 19
11
Strength to Weight: Axial, points 10
1.2
Strength to Weight: Bending, points 12
2.8
Thermal Diffusivity, mm2/s 17
30
Thermal Shock Resistance, points 12
3.5

Alloy Composition

Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0
0 to 0.050
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.050
Cadmium (Cd), % 0
0 to 0.0020
Copper (Cu), % 88.5 to 90.5
0 to 0.080
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0 to 0.050
0 to 0.020
Lead (Pb), % 0
49 to 50.5
Manganese (Mn), % 0 to 0.5
0
Nickel (Ni), % 9.5 to 10.5
0 to 0.010
Silver (Ag), % 0
0 to 0.1
Tin (Sn), % 0
49.5 to 50.5
Zinc (Zn), % 0
0 to 0.0010
Residuals, % 0 to 0.5
0