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C70700 Copper-nickel vs. Solder Alloy 124

C70700 copper-nickel belongs to the copper alloys classification, while solder alloy 124 belongs to the otherwise unclassified metals. There are 24 material properties with values for both materials. Properties with values for just one material (6, in this case) are not shown.

For each property being compared, the top bar is C70700 copper-nickel and the bottom bar is solder alloy 124.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
17
Elongation at Break, % 39
46
Poisson's Ratio 0.34
0.44
Shear Modulus, GPa 46
5.8
Tensile Strength: Ultimate (UTS), MPa 320
27

Thermal Properties

Latent Heat of Fusion, J/g 220
24
Melting Completion (Liquidus), °C 1120
330
Melting Onset (Solidus), °C 1060
320
Specific Heat Capacity, J/kg-K 390
130
Thermal Conductivity, W/m-K 59
22
Thermal Expansion, µm/m-K 16
29

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 11
9.6
Electrical Conductivity: Equal Weight (Specific), % IACS 12
7.7

Otherwise Unclassified Properties

Base Metal Price, % relative 34
70
Density, g/cm3 8.9
11
Embodied Carbon, kg CO2/kg material 3.4
4.1
Embodied Energy, MJ/kg 52
68
Embodied Water, L/kg 300
470

Common Calculations

Stiffness to Weight: Axial, points 7.6
0.83
Stiffness to Weight: Bending, points 19
7.6
Strength to Weight: Axial, points 10
0.65
Strength to Weight: Bending, points 12
1.8
Thermal Diffusivity, mm2/s 17
15
Thermal Shock Resistance, points 12
3.9

Alloy Composition

Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0
0 to 0.12
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.1
Cadmium (Cd), % 0
0 to 0.0020
Copper (Cu), % 88.5 to 90.5
0 to 0.080
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0 to 0.050
0 to 0.020
Lead (Pb), % 0
97.2 to 98.2
Manganese (Mn), % 0 to 0.5
0
Nickel (Ni), % 9.5 to 10.5
0 to 0.010
Silver (Ag), % 0
0 to 0.1
Tin (Sn), % 0
1.8 to 2.2
Zinc (Zn), % 0
0 to 0.0010
Residuals, % 0 to 0.5
0