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C70700 Copper-nickel vs. Solder Alloy 801

C70700 copper-nickel belongs to the copper alloys classification, while solder alloy 801 belongs to the otherwise unclassified metals. There are 24 material properties with values for both materials. Properties with values for just one material (6, in this case) are not shown.

For each property being compared, the top bar is C70700 copper-nickel and the bottom bar is solder alloy 801.

Metric UnitsUS Customary Units

Mechanical Properties

Brinell Hardness 73
22
Elastic (Young's, Tensile) Modulus, GPa 120
53
Elongation at Break, % 39
33
Poisson's Ratio 0.34
0.35
Shear Modulus, GPa 46
20
Tensile Strength: Ultimate (UTS), MPa 320
55

Thermal Properties

Latent Heat of Fusion, J/g 220
64
Melting Completion (Liquidus), °C 1120
200
Melting Onset (Solidus), °C 1060
200
Specific Heat Capacity, J/kg-K 390
240
Thermal Conductivity, W/m-K 59
61
Thermal Expansion, µm/m-K 16
22

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 11
15
Electrical Conductivity: Equal Weight (Specific), % IACS 12
19

Otherwise Unclassified Properties

Density, g/cm3 8.9
7.2
Embodied Carbon, kg CO2/kg material 3.4
14
Embodied Energy, MJ/kg 52
240
Embodied Water, L/kg 300
1140

Common Calculations

Stiffness to Weight: Axial, points 7.6
4.1
Stiffness to Weight: Bending, points 19
17
Strength to Weight: Axial, points 10
2.1
Strength to Weight: Bending, points 12
4.4
Thermal Diffusivity, mm2/s 17
36
Thermal Shock Resistance, points 12
3.3

Alloy Composition

Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0
0 to 0.1
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.1
Cadmium (Cd), % 0
0 to 0.0020
Copper (Cu), % 88.5 to 90.5
0 to 0.050
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0 to 0.050
0 to 0.020
Lead (Pb), % 0
0 to 0.070
Manganese (Mn), % 0 to 0.5
0
Nickel (Ni), % 9.5 to 10.5
0 to 0.010
Silver (Ag), % 0
0 to 0.1
Tin (Sn), % 0
89.9 to 91.5
Zinc (Zn), % 0
8.5 to 9.5
Residuals, % 0 to 0.5
0