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C70700 Copper-nickel vs. S31655 Stainless Steel

C70700 copper-nickel belongs to the copper alloys classification, while S31655 stainless steel belongs to the iron alloys. There are 30 material properties with values for both materials. Properties with values for just one material (4, in this case) are not shown.

For each property being compared, the top bar is C70700 copper-nickel and the bottom bar is S31655 stainless steel.

Metric UnitsUS Customary Units

Mechanical Properties

Brinell Hardness 73
210
Elastic (Young's, Tensile) Modulus, GPa 120
200
Elongation at Break, % 39
39
Poisson's Ratio 0.34
0.28
Shear Modulus, GPa 46
78
Shear Strength, MPa 220
490
Tensile Strength: Ultimate (UTS), MPa 320
710
Tensile Strength: Yield (Proof), MPa 110
350

Thermal Properties

Latent Heat of Fusion, J/g 220
290
Maximum Temperature: Mechanical, °C 220
1010
Melting Completion (Liquidus), °C 1120
1430
Melting Onset (Solidus), °C 1060
1380
Specific Heat Capacity, J/kg-K 390
480
Thermal Conductivity, W/m-K 59
15
Thermal Expansion, µm/m-K 16
16

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 11
2.4
Electrical Conductivity: Equal Weight (Specific), % IACS 12
2.7

Otherwise Unclassified Properties

Base Metal Price, % relative 34
17
Density, g/cm3 8.9
7.8
Embodied Carbon, kg CO2/kg material 3.4
3.3
Embodied Energy, MJ/kg 52
46
Embodied Water, L/kg 300
160

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 100
230
Resilience: Unit (Modulus of Resilience), kJ/m3 51
310
Stiffness to Weight: Axial, points 7.6
14
Stiffness to Weight: Bending, points 19
25
Strength to Weight: Axial, points 10
25
Strength to Weight: Bending, points 12
23
Thermal Diffusivity, mm2/s 17
4.0
Thermal Shock Resistance, points 12
16

Alloy Composition

Carbon (C), % 0
0 to 0.030
Chromium (Cr), % 0
19.5 to 21.5
Copper (Cu), % 88.5 to 90.5
0 to 1.0
Iron (Fe), % 0 to 0.050
63.2 to 71.9
Manganese (Mn), % 0 to 0.5
0 to 2.0
Molybdenum (Mo), % 0
0.5 to 1.5
Nickel (Ni), % 9.5 to 10.5
8.0 to 9.5
Nitrogen (N), % 0
0.14 to 0.25
Phosphorus (P), % 0
0 to 0.045
Silicon (Si), % 0
0 to 1.0
Sulfur (S), % 0
0 to 0.015
Residuals, % 0 to 0.5
0