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C70700 Copper-nickel vs. S82121 Stainless Steel

C70700 copper-nickel belongs to the copper alloys classification, while S82121 stainless steel belongs to the iron alloys. There are 30 material properties with values for both materials. Properties with values for just one material (4, in this case) are not shown.

For each property being compared, the top bar is C70700 copper-nickel and the bottom bar is S82121 stainless steel.

Metric UnitsUS Customary Units

Mechanical Properties

Brinell Hardness 73
250
Elastic (Young's, Tensile) Modulus, GPa 120
200
Elongation at Break, % 39
28
Poisson's Ratio 0.34
0.27
Shear Modulus, GPa 46
78
Shear Strength, MPa 220
470
Tensile Strength: Ultimate (UTS), MPa 320
730
Tensile Strength: Yield (Proof), MPa 110
510

Thermal Properties

Latent Heat of Fusion, J/g 220
290
Maximum Temperature: Mechanical, °C 220
1020
Melting Completion (Liquidus), °C 1120
1430
Melting Onset (Solidus), °C 1060
1380
Specific Heat Capacity, J/kg-K 390
480
Thermal Conductivity, W/m-K 59
15
Thermal Expansion, µm/m-K 16
13

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 11
2.2
Electrical Conductivity: Equal Weight (Specific), % IACS 12
2.5

Otherwise Unclassified Properties

Base Metal Price, % relative 34
14
Density, g/cm3 8.9
7.7
Embodied Carbon, kg CO2/kg material 3.4
2.8
Embodied Energy, MJ/kg 52
40
Embodied Water, L/kg 300
150

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 100
180
Resilience: Unit (Modulus of Resilience), kJ/m3 51
660
Stiffness to Weight: Axial, points 7.6
14
Stiffness to Weight: Bending, points 19
25
Strength to Weight: Axial, points 10
26
Strength to Weight: Bending, points 12
23
Thermal Diffusivity, mm2/s 17
4.0
Thermal Shock Resistance, points 12
20

Alloy Composition

Carbon (C), % 0
0 to 0.035
Chromium (Cr), % 0
21 to 23
Copper (Cu), % 88.5 to 90.5
0.2 to 1.2
Iron (Fe), % 0 to 0.050
66.7 to 75.4
Manganese (Mn), % 0 to 0.5
1.0 to 2.5
Molybdenum (Mo), % 0
0.3 to 1.3
Nickel (Ni), % 9.5 to 10.5
2.0 to 4.0
Nitrogen (N), % 0
0.15 to 0.25
Phosphorus (P), % 0
0 to 0.040
Silicon (Si), % 0
0 to 1.0
Sulfur (S), % 0
0 to 0.010
Residuals, % 0 to 0.5
0