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C71000 Copper-nickel vs. Solder Alloy 123

C71000 copper-nickel belongs to the copper alloys classification, while solder alloy 123 belongs to the otherwise unclassified metals. There are 23 material properties with values for both materials. Properties with values for just one material (5, in this case) are not shown.

For each property being compared, the top bar is C71000 copper-nickel and the bottom bar is solder alloy 123.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 130
18
Poisson's Ratio 0.33
0.44
Shear Modulus, GPa 49
6.2
Tensile Strength: Ultimate (UTS), MPa 320 to 560
28

Thermal Properties

Latent Heat of Fusion, J/g 230
26
Melting Completion (Liquidus), °C 1200
310
Melting Onset (Solidus), °C 1150
300
Specific Heat Capacity, J/kg-K 400
130
Thermal Conductivity, W/m-K 43
23
Thermal Expansion, µm/m-K 15
29

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 6.5
8.8
Electrical Conductivity: Equal Weight (Specific), % IACS 6.6
7.1

Otherwise Unclassified Properties

Base Metal Price, % relative 37
75
Density, g/cm3 8.9
11
Embodied Carbon, kg CO2/kg material 4.3
4.5
Embodied Energy, MJ/kg 63
74
Embodied Water, L/kg 290
500

Common Calculations

Stiffness to Weight: Axial, points 8.2
0.9
Stiffness to Weight: Bending, points 19
7.8
Strength to Weight: Axial, points 10 to 18
0.69
Strength to Weight: Bending, points 12 to 17
1.8
Thermal Diffusivity, mm2/s 12
16
Thermal Shock Resistance, points 12 to 20
3.8

Alloy Composition

Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0
0 to 0.5
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.1
Cadmium (Cd), % 0
0 to 0.0050
Copper (Cu), % 73.5 to 80.5
0 to 0.080
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0.5 to 1.0
0 to 0.020
Lead (Pb), % 0 to 0.050
93.5 to 95.5
Manganese (Mn), % 0 to 1.0
0
Nickel (Ni), % 19 to 23
0 to 0.010
Silver (Ag), % 0
0 to 0.1
Tin (Sn), % 0
4.5 to 5.5
Zinc (Zn), % 0 to 1.0
0 to 0.0010
Residuals, % 0 to 0.5
0