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C71500 Copper-nickel vs. Solder Alloy 123

C71500 copper-nickel belongs to the copper alloys classification, while solder alloy 123 belongs to the otherwise unclassified metals. There are 23 material properties with values for both materials. Properties with values for just one material (5, in this case) are not shown.

For each property being compared, the top bar is C71500 copper-nickel and the bottom bar is solder alloy 123.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 140
18
Poisson's Ratio 0.33
0.44
Shear Modulus, GPa 52
6.2
Tensile Strength: Ultimate (UTS), MPa 380 to 620
28

Thermal Properties

Latent Heat of Fusion, J/g 230
26
Melting Completion (Liquidus), °C 1240
310
Melting Onset (Solidus), °C 1170
300
Specific Heat Capacity, J/kg-K 400
130
Thermal Conductivity, W/m-K 28
23
Thermal Expansion, µm/m-K 16
29

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 4.6
8.8
Electrical Conductivity: Equal Weight (Specific), % IACS 4.7
7.1

Otherwise Unclassified Properties

Base Metal Price, % relative 41
75
Density, g/cm3 8.9
11
Embodied Carbon, kg CO2/kg material 5.1
4.5
Embodied Energy, MJ/kg 74
74
Embodied Water, L/kg 280
500

Common Calculations

Stiffness to Weight: Axial, points 8.6
0.9
Stiffness to Weight: Bending, points 19
7.8
Strength to Weight: Axial, points 12 to 19
0.69
Strength to Weight: Bending, points 13 to 18
1.8
Thermal Diffusivity, mm2/s 7.7
16
Thermal Shock Resistance, points 12 to 20
3.8

Alloy Composition

Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0
0 to 0.5
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.1
Cadmium (Cd), % 0
0 to 0.0050
Copper (Cu), % 63.5 to 70.6
0 to 0.080
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0.4 to 1.0
0 to 0.020
Lead (Pb), % 0 to 0.050
93.5 to 95.5
Manganese (Mn), % 0 to 1.0
0
Nickel (Ni), % 29 to 33
0 to 0.010
Silver (Ag), % 0
0 to 0.1
Tin (Sn), % 0
4.5 to 5.5
Zinc (Zn), % 0 to 1.0
0 to 0.0010
Residuals, % 0 to 0.5
0