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C71500 Copper-nickel vs. Solder Alloy 713

C71500 copper-nickel belongs to the copper alloys classification, while solder alloy 713 belongs to the otherwise unclassified metals. There are 21 material properties with values for both materials. Properties with values for just one material (7, in this case) are not shown.

For each property being compared, the top bar is C71500 copper-nickel and the bottom bar is solder alloy 713.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 140
51
Poisson's Ratio 0.33
0.36
Shear Modulus, GPa 52
19
Tensile Strength: Ultimate (UTS), MPa 380 to 620
59

Thermal Properties

Latent Heat of Fusion, J/g 230
62
Melting Completion (Liquidus), °C 1240
220
Melting Onset (Solidus), °C 1170
220
Specific Heat Capacity, J/kg-K 400
220
Thermal Conductivity, W/m-K 28
60
Thermal Expansion, µm/m-K 16
22

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 4.6
13
Electrical Conductivity: Equal Weight (Specific), % IACS 4.7
16

Otherwise Unclassified Properties

Density, g/cm3 8.9
7.4
Embodied Carbon, kg CO2/kg material 5.1
18
Embodied Energy, MJ/kg 74
300

Common Calculations

Stiffness to Weight: Axial, points 8.6
3.8
Stiffness to Weight: Bending, points 19
17
Strength to Weight: Axial, points 12 to 19
2.2
Strength to Weight: Bending, points 13 to 18
4.5
Thermal Diffusivity, mm2/s 7.7
36
Thermal Shock Resistance, points 12 to 20
3.7

Alloy Composition

Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0
0 to 0.1
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.1
Cadmium (Cd), % 0
0 to 0.0020
Copper (Cu), % 63.5 to 70.6
0.5 to 0.9
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0.4 to 1.0
0 to 0.020
Lead (Pb), % 0 to 0.050
0 to 0.070
Manganese (Mn), % 0 to 1.0
0
Nickel (Ni), % 29 to 33
0 to 0.010
Silver (Ag), % 0
3.6 to 4.0
Tin (Sn), % 0
94.6 to 95.9
Zinc (Zn), % 0 to 1.0
0 to 0.0010
Residuals, % 0 to 0.5
0