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C71500 Copper-nickel vs. Solder Alloy 811

C71500 copper-nickel belongs to the copper alloys classification, while solder alloy 811 belongs to the otherwise unclassified metals. There are 22 material properties with values for both materials. Properties with values for just one material (5, in this case) are not shown.

For each property being compared, the top bar is C71500 copper-nickel and the bottom bar is solder alloy 811.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 140
52
Poisson's Ratio 0.33
0.35
Shear Modulus, GPa 52
19
Tensile Strength: Ultimate (UTS), MPa 380 to 620
53

Thermal Properties

Latent Heat of Fusion, J/g 230
63
Melting Completion (Liquidus), °C 1240
200
Melting Onset (Solidus), °C 1170
190
Specific Heat Capacity, J/kg-K 400
230
Thermal Conductivity, W/m-K 28
59
Thermal Expansion, µm/m-K 16
22

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 4.6
14
Electrical Conductivity: Equal Weight (Specific), % IACS 4.7
17

Otherwise Unclassified Properties

Density, g/cm3 8.9
7.3
Embodied Carbon, kg CO2/kg material 5.1
14
Embodied Energy, MJ/kg 74
240
Embodied Water, L/kg 280
1200

Common Calculations

Stiffness to Weight: Axial, points 8.6
4.0
Stiffness to Weight: Bending, points 19
17
Strength to Weight: Axial, points 12 to 19
2.0
Strength to Weight: Bending, points 13 to 18
4.3
Thermal Diffusivity, mm2/s 7.7
35
Thermal Shock Resistance, points 12 to 20
3.3

Alloy Composition

Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0
0 to 0.1
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
2.8 to 3.2
Cadmium (Cd), % 0
0 to 0.0020
Copper (Cu), % 63.5 to 70.6
0 to 0.050
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0.4 to 1.0
0 to 0.020
Lead (Pb), % 0 to 0.050
0 to 0.070
Manganese (Mn), % 0 to 1.0
0
Nickel (Ni), % 29 to 33
0 to 0.010
Silver (Ag), % 0
0 to 0.1
Tin (Sn), % 0
87.8 to 89.7
Zinc (Zn), % 0 to 1.0
7.5 to 8.5
Residuals, % 0 to 0.5
0