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C72150 Copper-nickel vs. ASTM A182 Grade F11 Class 1

C72150 copper-nickel belongs to the copper alloys classification, while ASTM A182 grade F11 class 1 belongs to the iron alloys. There are 30 material properties with values for both materials. Properties with values for just one material (3, in this case) are not shown.

For each property being compared, the top bar is C72150 copper-nickel and the bottom bar is ASTM A182 grade F11 class 1.

Metric UnitsUS Customary Units

Mechanical Properties

Brinell Hardness 99
150
Elastic (Young's, Tensile) Modulus, GPa 150
190
Elongation at Break, % 29
23
Poisson's Ratio 0.33
0.29
Shear Modulus, GPa 55
73
Shear Strength, MPa 320
300
Tensile Strength: Ultimate (UTS), MPa 490
470
Tensile Strength: Yield (Proof), MPa 210
230

Thermal Properties

Latent Heat of Fusion, J/g 250
260
Maximum Temperature: Mechanical, °C 600
430
Melting Completion (Liquidus), °C 1210
1460
Melting Onset (Solidus), °C 1250
1420
Specific Heat Capacity, J/kg-K 410
470
Thermal Conductivity, W/m-K 22
39
Thermal Expansion, µm/m-K 14
13

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 3.5
7.4
Electrical Conductivity: Equal Weight (Specific), % IACS 3.6
8.5

Otherwise Unclassified Properties

Base Metal Price, % relative 45
2.9
Density, g/cm3 8.9
7.8
Embodied Carbon, kg CO2/kg material 6.1
1.6
Embodied Energy, MJ/kg 88
21
Embodied Water, L/kg 270
52

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 120
89
Resilience: Unit (Modulus of Resilience), kJ/m3 150
140
Stiffness to Weight: Axial, points 9.1
13
Stiffness to Weight: Bending, points 20
24
Strength to Weight: Axial, points 15
17
Strength to Weight: Bending, points 15
17
Thermal Diffusivity, mm2/s 6.0
11
Thermal Shock Resistance, points 18
14

Alloy Composition

Carbon (C), % 0 to 0.1
0.050 to 0.15
Chromium (Cr), % 0
1.0 to 1.5
Copper (Cu), % 52.5 to 57
0
Iron (Fe), % 0 to 0.1
96 to 97.7
Lead (Pb), % 0 to 0.050
0
Manganese (Mn), % 0 to 0.050
0.3 to 0.6
Molybdenum (Mo), % 0
0.44 to 0.65
Nickel (Ni), % 43 to 46
0
Phosphorus (P), % 0
0 to 0.030
Silicon (Si), % 0 to 0.5
0.5 to 1.0
Sulfur (S), % 0
0 to 0.030
Zinc (Zn), % 0 to 0.2
0
Residuals, % 0 to 0.5
0