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C72150 Copper-nickel vs. ASTM A372 Grade L Steel

C72150 copper-nickel belongs to the copper alloys classification, while ASTM A372 grade L steel belongs to the iron alloys. There are 30 material properties with values for both materials. Properties with values for just one material (1, in this case) are not shown.

For each property being compared, the top bar is C72150 copper-nickel and the bottom bar is ASTM A372 grade L steel.

Metric UnitsUS Customary Units

Mechanical Properties

Brinell Hardness 99
350
Elastic (Young's, Tensile) Modulus, GPa 150
190
Elongation at Break, % 29
14
Poisson's Ratio 0.33
0.29
Shear Modulus, GPa 55
73
Shear Strength, MPa 320
700
Tensile Strength: Ultimate (UTS), MPa 490
1160
Tensile Strength: Yield (Proof), MPa 210
1040

Thermal Properties

Latent Heat of Fusion, J/g 250
250
Maximum Temperature: Mechanical, °C 600
430
Melting Completion (Liquidus), °C 1210
1460
Melting Onset (Solidus), °C 1250
1420
Specific Heat Capacity, J/kg-K 410
470
Thermal Conductivity, W/m-K 22
44
Thermal Expansion, µm/m-K 14
13

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 3.5
7.5
Electrical Conductivity: Equal Weight (Specific), % IACS 3.6
8.6

Otherwise Unclassified Properties

Base Metal Price, % relative 45
3.5
Density, g/cm3 8.9
7.8
Embodied Carbon, kg CO2/kg material 6.1
1.7
Embodied Energy, MJ/kg 88
22
Embodied Water, L/kg 270
54

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 120
150
Resilience: Unit (Modulus of Resilience), kJ/m3 150
2890
Stiffness to Weight: Axial, points 9.1
13
Stiffness to Weight: Bending, points 20
24
Strength to Weight: Axial, points 15
41
Strength to Weight: Bending, points 15
31
Thermal Diffusivity, mm2/s 6.0
12
Thermal Shock Resistance, points 18
34

Alloy Composition

Carbon (C), % 0 to 0.1
0.38 to 0.43
Chromium (Cr), % 0
0.7 to 0.9
Copper (Cu), % 52.5 to 57
0
Iron (Fe), % 0 to 0.1
95.2 to 96.3
Lead (Pb), % 0 to 0.050
0
Manganese (Mn), % 0 to 0.050
0.6 to 0.8
Molybdenum (Mo), % 0
0.2 to 0.3
Nickel (Ni), % 43 to 46
1.7 to 2.0
Phosphorus (P), % 0
0 to 0.015
Silicon (Si), % 0 to 0.5
0.15 to 0.35
Sulfur (S), % 0
0 to 0.010
Zinc (Zn), % 0 to 0.2
0
Residuals, % 0 to 0.5
0