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C72150 Copper-nickel vs. C17510 Copper

Both C72150 copper-nickel and C17510 copper are copper alloys. They have 57% of their average alloy composition in common. There are 29 material properties with values for both materials. Properties with values for just one material (2, in this case) are not shown.

For each property being compared, the top bar is C72150 copper-nickel and the bottom bar is C17510 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 150
120
Elongation at Break, % 29
5.4 to 37
Poisson's Ratio 0.33
0.34
Shear Modulus, GPa 55
44
Shear Strength, MPa 320
210 to 500
Tensile Strength: Ultimate (UTS), MPa 490
310 to 860
Tensile Strength: Yield (Proof), MPa 210
120 to 750

Thermal Properties

Latent Heat of Fusion, J/g 250
220
Maximum Temperature: Mechanical, °C 600
220
Melting Completion (Liquidus), °C 1210
1070
Melting Onset (Solidus), °C 1250
1030
Specific Heat Capacity, J/kg-K 410
390
Thermal Conductivity, W/m-K 22
210
Thermal Expansion, µm/m-K 14
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 3.5
22 to 54
Electrical Conductivity: Equal Weight (Specific), % IACS 3.6
23 to 54

Otherwise Unclassified Properties

Base Metal Price, % relative 45
49
Density, g/cm3 8.9
8.9
Embodied Carbon, kg CO2/kg material 6.1
4.2
Embodied Energy, MJ/kg 88
65
Embodied Water, L/kg 270
310

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 120
39 to 92
Resilience: Unit (Modulus of Resilience), kJ/m3 150
64 to 2410
Stiffness to Weight: Axial, points 9.1
7.4
Stiffness to Weight: Bending, points 20
18
Strength to Weight: Axial, points 15
9.7 to 27
Strength to Weight: Bending, points 15
11 to 23
Thermal Diffusivity, mm2/s 6.0
60
Thermal Shock Resistance, points 18
11 to 30

Alloy Composition

Aluminum (Al), % 0
0 to 0.2
Beryllium (Be), % 0
0.2 to 0.6
Carbon (C), % 0 to 0.1
0
Cobalt (Co), % 0
0 to 0.3
Copper (Cu), % 52.5 to 57
95.9 to 98.4
Iron (Fe), % 0 to 0.1
0 to 0.1
Lead (Pb), % 0 to 0.050
0
Manganese (Mn), % 0 to 0.050
0
Nickel (Ni), % 43 to 46
1.4 to 2.2
Silicon (Si), % 0 to 0.5
0 to 0.2
Zinc (Zn), % 0 to 0.2
0
Residuals, % 0
0 to 0.5