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C72500 Copper-nickel vs. 2011 Aluminum

C72500 copper-nickel belongs to the copper alloys classification, while 2011 aluminum belongs to the aluminum alloys. There are 24 material properties with values for both materials. Properties with values for just one material (8, in this case) are not shown. Please note that the two materials have significantly dissimilar densities. This means that additional care is required when interpreting the data, because some material properties are based on units of mass, while others are based on units of area or volume.

For each property being compared, the top bar is C72500 copper-nickel and the bottom bar is 2011 aluminum.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
71
Poisson's Ratio 0.34
0.33
Shear Modulus, GPa 45
27
Tensile Strength: Ultimate (UTS), MPa 420 to 780
310 to 420

Thermal Properties

Latent Heat of Fusion, J/g 210
390
Maximum Temperature: Mechanical, °C 210
190
Melting Completion (Liquidus), °C 1130
640
Melting Onset (Solidus), °C 1060
540
Specific Heat Capacity, J/kg-K 390
870
Thermal Conductivity, W/m-K 54
140 to 170
Thermal Expansion, µm/m-K 17
23

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 11
35 to 45
Electrical Conductivity: Equal Weight (Specific), % IACS 11
100 to 130

Otherwise Unclassified Properties

Base Metal Price, % relative 35
11
Density, g/cm3 8.9
3.1
Embodied Carbon, kg CO2/kg material 3.6
7.9
Embodied Energy, MJ/kg 55
150
Embodied Water, L/kg 320
1150

Common Calculations

Stiffness to Weight: Axial, points 7.6
13
Stiffness to Weight: Bending, points 19
44
Strength to Weight: Axial, points 13 to 24
27 to 37
Strength to Weight: Bending, points 14 to 21
32 to 40
Thermal Diffusivity, mm2/s 16
51 to 64
Thermal Shock Resistance, points 14 to 27
14 to 19

Alloy Composition

Aluminum (Al), % 0
91.3 to 94.6
Bismuth (Bi), % 0
0.2 to 0.6
Copper (Cu), % 85.2 to 89.7
5.0 to 6.0
Iron (Fe), % 0 to 0.6
0 to 0.7
Lead (Pb), % 0 to 0.050
0.2 to 0.6
Manganese (Mn), % 0 to 0.2
0
Nickel (Ni), % 8.5 to 10.5
0
Silicon (Si), % 0
0 to 0.4
Tin (Sn), % 1.8 to 2.8
0
Zinc (Zn), % 0 to 0.5
0 to 0.3
Residuals, % 0
0 to 0.15