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C72500 Copper-nickel vs. Solder Alloy 103

C72500 copper-nickel belongs to the copper alloys classification, while solder alloy 103 belongs to the otherwise unclassified metals. There are 22 material properties with values for both materials. Properties with values for just one material (5, in this case) are not shown.

For each property being compared, the top bar is C72500 copper-nickel and the bottom bar is solder alloy 103.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
37
Poisson's Ratio 0.34
0.39
Shear Modulus, GPa 45
13
Tensile Strength: Ultimate (UTS), MPa 420 to 780
52

Thermal Properties

Latent Heat of Fusion, J/g 210
45
Melting Completion (Liquidus), °C 1130
190
Melting Onset (Solidus), °C 1060
180
Specific Heat Capacity, J/kg-K 390
180
Thermal Conductivity, W/m-K 54
50
Thermal Expansion, µm/m-K 17
24

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 11
11
Electrical Conductivity: Equal Weight (Specific), % IACS 11
12

Otherwise Unclassified Properties

Density, g/cm3 8.9
8.9
Embodied Carbon, kg CO2/kg material 3.6
10
Embodied Energy, MJ/kg 55
180
Embodied Water, L/kg 320
910

Common Calculations

Stiffness to Weight: Axial, points 7.6
2.3
Stiffness to Weight: Bending, points 19
12
Strength to Weight: Axial, points 13 to 24
1.6
Strength to Weight: Bending, points 14 to 21
3.5
Thermal Diffusivity, mm2/s 16
30
Thermal Shock Resistance, points 14 to 27
4.3

Alloy Composition

Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0
0 to 0.2
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.1
Cadmium (Cd), % 0
0 to 0.0020
Copper (Cu), % 85.2 to 89.7
0 to 0.080
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0 to 0.6
0 to 0.020
Lead (Pb), % 0 to 0.050
38.8 to 40.5
Manganese (Mn), % 0 to 0.2
0
Nickel (Ni), % 8.5 to 10.5
0 to 0.010
Silver (Ag), % 0
0 to 0.1
Tin (Sn), % 1.8 to 2.8
59.5 to 60.5
Zinc (Zn), % 0 to 0.5
0 to 0.0010
Residuals, % 0 to 0.2
0