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C72900 Copper-nickel vs. C93900 Bronze

Both C72900 copper-nickel and C93900 bronze are copper alloys. They have 83% of their average alloy composition in common. There are 28 material properties with values for both materials. Properties with values for just one material (1, in this case) are not shown.

For each property being compared, the top bar is C72900 copper-nickel and the bottom bar is C93900 bronze.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
95
Elongation at Break, % 6.0 to 20
5.6
Poisson's Ratio 0.34
0.36
Shear Modulus, GPa 45
35
Tensile Strength: Ultimate (UTS), MPa 870 to 1080
190
Tensile Strength: Yield (Proof), MPa 700 to 920
130

Thermal Properties

Latent Heat of Fusion, J/g 210
170
Maximum Temperature: Mechanical, °C 210
140
Melting Completion (Liquidus), °C 1120
940
Melting Onset (Solidus), °C 950
850
Specific Heat Capacity, J/kg-K 380
340
Thermal Conductivity, W/m-K 29
52
Thermal Expansion, µm/m-K 17
19

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 7.8
11
Electrical Conductivity: Equal Weight (Specific), % IACS 8.0
11

Otherwise Unclassified Properties

Base Metal Price, % relative 39
30
Density, g/cm3 8.8
9.1
Embodied Carbon, kg CO2/kg material 4.6
3.0
Embodied Energy, MJ/kg 72
49
Embodied Water, L/kg 360
360

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 49 to 210
9.5
Resilience: Unit (Modulus of Resilience), kJ/m3 2030 to 3490
83
Stiffness to Weight: Axial, points 7.6
5.8
Stiffness to Weight: Bending, points 19
17
Strength to Weight: Axial, points 27 to 34
5.9
Strength to Weight: Bending, points 23 to 27
8.1
Thermal Diffusivity, mm2/s 8.6
17
Thermal Shock Resistance, points 31 to 38
7.5

Alloy Composition

Aluminum (Al), % 0
0 to 0.0050
Antimony (Sb), % 0
0 to 0.5
Copper (Cu), % 74.1 to 78
76.5 to 79.5
Iron (Fe), % 0 to 0.5
0 to 0.4
Lead (Pb), % 0 to 0.020
14 to 18
Magnesium (Mg), % 0 to 0.15
0
Manganese (Mn), % 0 to 0.3
0
Nickel (Ni), % 14.5 to 15.5
0 to 0.8
Niobium (Nb), % 0 to 0.1
0
Phosphorus (P), % 0
0 to 1.5
Silicon (Si), % 0
0 to 0.0050
Sulfur (S), % 0
0 to 0.080
Tin (Sn), % 7.5 to 8.5
5.0 to 7.0
Zinc (Zn), % 0 to 0.5
0 to 1.5
Residuals, % 0
0 to 1.1