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C73500 Nickel Silver vs. Solder Alloy 123

C73500 nickel silver belongs to the copper alloys classification, while solder alloy 123 belongs to the otherwise unclassified metals. There are 23 material properties with values for both materials. Properties with values for just one material (5, in this case) are not shown.

For each property being compared, the top bar is C73500 nickel silver and the bottom bar is solder alloy 123.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 130
18
Poisson's Ratio 0.33
0.44
Shear Modulus, GPa 47
6.2
Tensile Strength: Ultimate (UTS), MPa 380 to 580
28

Thermal Properties

Latent Heat of Fusion, J/g 210
26
Melting Completion (Liquidus), °C 1140
310
Melting Onset (Solidus), °C 1090
300
Specific Heat Capacity, J/kg-K 400
130
Thermal Conductivity, W/m-K 36
23
Thermal Expansion, µm/m-K 17
29

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 6.5
8.8
Electrical Conductivity: Equal Weight (Specific), % IACS 6.7
7.1

Otherwise Unclassified Properties

Base Metal Price, % relative 35
75
Density, g/cm3 8.7
11
Embodied Carbon, kg CO2/kg material 4.0
4.5
Embodied Energy, MJ/kg 61
74
Embodied Water, L/kg 300
500

Common Calculations

Stiffness to Weight: Axial, points 8.0
0.9
Stiffness to Weight: Bending, points 19
7.8
Strength to Weight: Axial, points 12 to 19
0.69
Strength to Weight: Bending, points 13 to 18
1.8
Thermal Diffusivity, mm2/s 10
16
Thermal Shock Resistance, points 13 to 19
3.8

Alloy Composition

Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0
0 to 0.5
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.1
Cadmium (Cd), % 0
0 to 0.0050
Copper (Cu), % 70.5 to 73.5
0 to 0.080
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0 to 0.25
0 to 0.020
Lead (Pb), % 0 to 0.1
93.5 to 95.5
Manganese (Mn), % 0 to 0.5
0
Nickel (Ni), % 16.5 to 19.5
0 to 0.010
Silver (Ag), % 0
0 to 0.1
Tin (Sn), % 0
4.5 to 5.5
Zinc (Zn), % 5.7 to 13
0 to 0.0010
Residuals, % 0 to 0.5
0