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C74500 Nickel Silver vs. Solder Alloy 401

C74500 nickel silver belongs to the copper alloys classification, while solder alloy 401 belongs to the otherwise unclassified metals. There are 23 material properties with values for both materials. Properties with values for just one material (9, in this case) are not shown.

For each property being compared, the top bar is C74500 nickel silver and the bottom bar is solder alloy 401.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
50
Elongation at Break, % 3.0 to 24
21
Poisson's Ratio 0.32
0.36
Shear Modulus, GPa 44
19
Tensile Strength: Ultimate (UTS), MPa 390 to 700
29

Thermal Properties

Latent Heat of Fusion, J/g 190
60
Melting Completion (Liquidus), °C 1020
230
Melting Onset (Solidus), °C 970
230
Specific Heat Capacity, J/kg-K 390
220
Thermal Conductivity, W/m-K 45
66
Thermal Expansion, µm/m-K 19
22

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 9.0
14
Electrical Conductivity: Equal Weight (Specific), % IACS 9.7
17

Otherwise Unclassified Properties

Density, g/cm3 8.3
7.3
Embodied Carbon, kg CO2/kg material 3.4
15
Embodied Energy, MJ/kg 54
250
Embodied Water, L/kg 310
1200

Common Calculations

Stiffness to Weight: Axial, points 7.7
3.8
Stiffness to Weight: Bending, points 19
17
Strength to Weight: Axial, points 13 to 23
1.1
Strength to Weight: Bending, points 14 to 21
2.9
Thermal Diffusivity, mm2/s 14
40
Thermal Shock Resistance, points 13 to 23
1.9

Alloy Composition

Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0
0 to 0.1
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.1
Cadmium (Cd), % 0
0 to 0.0020
Copper (Cu), % 63.5 to 66.5
0.5 to 0.9
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0 to 0.25
0 to 0.020
Lead (Pb), % 0 to 0.1
0 to 0.070
Manganese (Mn), % 0 to 0.5
0
Nickel (Ni), % 9.0 to 11
0 to 0.010
Silver (Ag), % 0
0 to 0.1
Tin (Sn), % 0
98.5 to 99.5
Zinc (Zn), % 21.2 to 27.5
0 to 0.0010
Residuals, % 0 to 0.5
0