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C74500 Nickel Silver vs. C18900 Copper

Both C74500 nickel silver and C18900 copper are copper alloys. They have 66% of their average alloy composition in common. There are 29 material properties with values for both materials. Properties with values for just one material (2, in this case) are not shown.

For each property being compared, the top bar is C74500 nickel silver and the bottom bar is C18900 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
120
Elongation at Break, % 3.0 to 24
14 to 48
Poisson's Ratio 0.32
0.34
Shear Modulus, GPa 44
43
Shear Strength, MPa 310 to 380
190 to 300
Tensile Strength: Ultimate (UTS), MPa 390 to 700
260 to 500
Tensile Strength: Yield (Proof), MPa 380 to 600
67 to 390

Thermal Properties

Latent Heat of Fusion, J/g 190
210
Maximum Temperature: Mechanical, °C 170
200
Melting Completion (Liquidus), °C 1020
1080
Melting Onset (Solidus), °C 970
1020
Specific Heat Capacity, J/kg-K 390
390
Thermal Conductivity, W/m-K 45
130
Thermal Expansion, µm/m-K 19
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 9.0
30
Electrical Conductivity: Equal Weight (Specific), % IACS 9.7
30

Otherwise Unclassified Properties

Base Metal Price, % relative 29
31
Density, g/cm3 8.3
8.9
Embodied Carbon, kg CO2/kg material 3.4
2.7
Embodied Energy, MJ/kg 54
42
Embodied Water, L/kg 310
310

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 12 to 160
65 to 95
Resilience: Unit (Modulus of Resilience), kJ/m3 620 to 1540
20 to 660
Stiffness to Weight: Axial, points 7.7
7.2
Stiffness to Weight: Bending, points 19
18
Strength to Weight: Axial, points 13 to 23
8.2 to 16
Strength to Weight: Bending, points 14 to 21
10 to 16
Thermal Diffusivity, mm2/s 14
38
Thermal Shock Resistance, points 13 to 23
9.3 to 18

Alloy Composition

Aluminum (Al), % 0
0 to 0.010
Copper (Cu), % 63.5 to 66.5
97.7 to 99.15
Iron (Fe), % 0 to 0.25
0
Lead (Pb), % 0 to 0.1
0 to 0.020
Manganese (Mn), % 0 to 0.5
0.1 to 0.3
Nickel (Ni), % 9.0 to 11
0
Phosphorus (P), % 0
0 to 0.050
Silicon (Si), % 0
0.15 to 0.4
Tin (Sn), % 0
0.6 to 0.9
Zinc (Zn), % 21.2 to 27.5
0 to 0.1
Residuals, % 0
0 to 0.5

Comparable Variants