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C75200 Nickel Silver vs. Solder Alloy 191

C75200 nickel silver belongs to the copper alloys classification, while solder alloy 191 belongs to the otherwise unclassified metals. There are 21 material properties with values for both materials. Properties with values for just one material (6, in this case) are not shown.

For each property being compared, the top bar is C75200 nickel silver and the bottom bar is solder alloy 191.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
19
Poisson's Ratio 0.32
0.43
Shear Modulus, GPa 47
6.5
Tensile Strength: Ultimate (UTS), MPa 400 to 660
29

Thermal Properties

Latent Heat of Fusion, J/g 210
27
Melting Completion (Liquidus), °C 1110
300
Melting Onset (Solidus), °C 1070
300
Specific Heat Capacity, J/kg-K 400
130
Thermal Conductivity, W/m-K 33
24
Thermal Expansion, µm/m-K 18
29

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 6.0
8.8
Electrical Conductivity: Equal Weight (Specific), % IACS 6.3
7.2

Otherwise Unclassified Properties

Density, g/cm3 8.5
11
Embodied Carbon, kg CO2/kg material 4.1
5.8
Embodied Energy, MJ/kg 62
95

Common Calculations

Stiffness to Weight: Axial, points 8.0
0.93
Stiffness to Weight: Bending, points 19
8.0
Strength to Weight: Axial, points 13 to 21
0.72
Strength to Weight: Bending, points 14 to 20
1.9
Thermal Diffusivity, mm2/s 9.8
16
Thermal Shock Resistance, points 13 to 22
3.9

Alloy Composition

Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0
0 to 0.2
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.1
Cadmium (Cd), % 0
0 to 0.0020
Copper (Cu), % 63.5 to 66.5
0 to 0.080
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0 to 0.25
0 to 0.020
Lead (Pb), % 0 to 0.050
92.4 to 94
Manganese (Mn), % 0 to 0.5
0
Nickel (Ni), % 16.5 to 19.5
0 to 0.010
Silver (Ag), % 0
1.2 to 1.8
Tin (Sn), % 0
4.8 to 5.2
Zinc (Zn), % 12.7 to 20
0 to 0.0010
Residuals, % 0 to 0.5
0