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C75400 Nickel Silver vs. Solder Alloy 115

C75400 nickel silver belongs to the copper alloys classification, while solder alloy 115 belongs to the otherwise unclassified metals. There are 24 material properties with values for both materials. Properties with values for just one material (8, in this case) are not shown.

For each property being compared, the top bar is C75400 nickel silver and the bottom bar is solder alloy 115.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
28
Elongation at Break, % 2.0 to 43
22
Poisson's Ratio 0.32
0.41
Shear Modulus, GPa 46
10
Tensile Strength: Ultimate (UTS), MPa 370 to 630
36

Thermal Properties

Latent Heat of Fusion, J/g 200
36
Melting Completion (Liquidus), °C 1080
250
Melting Onset (Solidus), °C 1040
180
Specific Heat Capacity, J/kg-K 390
160
Thermal Conductivity, W/m-K 36
43
Thermal Expansion, µm/m-K 18
27

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 7.0
9.8
Electrical Conductivity: Equal Weight (Specific), % IACS 7.4
8.9

Otherwise Unclassified Properties

Base Metal Price, % relative 32
95
Density, g/cm3 8.5
9.9
Embodied Carbon, kg CO2/kg material 3.8
7.8
Embodied Energy, MJ/kg 59
130
Embodied Water, L/kg 300
730

Common Calculations

Stiffness to Weight: Axial, points 7.9
1.6
Stiffness to Weight: Bending, points 19
10
Strength to Weight: Axial, points 12 to 21
1.0
Strength to Weight: Bending, points 13 to 19
2.4
Thermal Diffusivity, mm2/s 11
27
Thermal Shock Resistance, points 12 to 21
3.4

Alloy Composition

Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0
0 to 0.5
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.25
Cadmium (Cd), % 0
0 to 0.0050
Copper (Cu), % 63.5 to 66.5
0 to 0.080
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0 to 0.25
0 to 0.020
Lead (Pb), % 0 to 0.1
63.4 to 65.5
Manganese (Mn), % 0 to 0.5
0
Nickel (Ni), % 14 to 16
0 to 0.010
Silver (Ag), % 0
0 to 0.1
Tin (Sn), % 0
34.5 to 35.5
Zinc (Zn), % 16.2 to 22.5
0 to 0.0010
Residuals, % 0 to 0.5
0