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C75400 Nickel Silver vs. C82500 Copper

Both C75400 nickel silver and C82500 copper are copper alloys. They have 66% of their average alloy composition in common. There are 27 material properties with values for both materials. Properties with values for just one material (4, in this case) are not shown.

For each property being compared, the top bar is C75400 nickel silver and the bottom bar is C82500 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
120
Elongation at Break, % 2.0 to 43
1.0 to 20
Poisson's Ratio 0.32
0.33
Shear Modulus, GPa 46
45
Tensile Strength: Ultimate (UTS), MPa 370 to 630
550 to 1100
Tensile Strength: Yield (Proof), MPa 130 to 590
310 to 980

Thermal Properties

Latent Heat of Fusion, J/g 200
240
Maximum Temperature: Mechanical, °C 190
280
Melting Completion (Liquidus), °C 1080
980
Melting Onset (Solidus), °C 1040
860
Specific Heat Capacity, J/kg-K 390
390
Thermal Conductivity, W/m-K 36
130
Thermal Expansion, µm/m-K 18
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 7.0
20
Electrical Conductivity: Equal Weight (Specific), % IACS 7.4
21

Otherwise Unclassified Properties

Density, g/cm3 8.5
8.8
Embodied Carbon, kg CO2/kg material 3.8
10
Embodied Energy, MJ/kg 59
160
Embodied Water, L/kg 300
310

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 12 to 120
11 to 94
Resilience: Unit (Modulus of Resilience), kJ/m3 75 to 1450
400 to 4000
Stiffness to Weight: Axial, points 7.9
7.7
Stiffness to Weight: Bending, points 19
19
Strength to Weight: Axial, points 12 to 21
18 to 35
Strength to Weight: Bending, points 13 to 19
17 to 27
Thermal Diffusivity, mm2/s 11
38
Thermal Shock Resistance, points 12 to 21
19 to 38

Alloy Composition

Aluminum (Al), % 0
0 to 0.15
Beryllium (Be), % 0
1.9 to 2.3
Chromium (Cr), % 0
0 to 0.1
Cobalt (Co), % 0
0.15 to 0.7
Copper (Cu), % 63.5 to 66.5
95.3 to 97.8
Iron (Fe), % 0 to 0.25
0 to 0.25
Lead (Pb), % 0 to 0.1
0 to 0.020
Manganese (Mn), % 0 to 0.5
0
Nickel (Ni), % 14 to 16
0 to 0.2
Silicon (Si), % 0
0.2 to 0.35
Tin (Sn), % 0
0 to 0.1
Titanium (Ti), % 0
0 to 0.12
Zinc (Zn), % 16.2 to 22.5
0 to 0.1
Residuals, % 0
0 to 0.5