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C77300 Nickel Silver vs. Solder Alloy 811

C77300 nickel silver belongs to the copper alloys classification, while solder alloy 811 belongs to the otherwise unclassified metals. There are 20 material properties with values for both materials. Properties with values for just one material (6, in this case) are not shown.

For each property being compared, the top bar is C77300 nickel silver and the bottom bar is solder alloy 811.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 110
52
Poisson's Ratio 0.3
0.35
Shear Modulus, GPa 42
19
Tensile Strength: Ultimate (UTS), MPa 540
53

Thermal Properties

Latent Heat of Fusion, J/g 180
63
Melting Completion (Liquidus), °C 940
200
Melting Onset (Solidus), °C 920
190
Specific Heat Capacity, J/kg-K 390
230
Thermal Expansion, µm/m-K 20
22

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 5.5
14
Electrical Conductivity: Equal Weight (Specific), % IACS 6.3
17

Otherwise Unclassified Properties

Density, g/cm3 7.9
7.3
Embodied Carbon, kg CO2/kg material 3.5
14
Embodied Energy, MJ/kg 56
240
Embodied Water, L/kg 310
1200

Common Calculations

Stiffness to Weight: Axial, points 7.7
4.0
Stiffness to Weight: Bending, points 20
17
Strength to Weight: Axial, points 19
2.0
Strength to Weight: Bending, points 19
4.3
Thermal Shock Resistance, points 17
3.3

Alloy Composition

Aluminum (Al), % 0 to 0.010
0 to 0.0010
Antimony (Sb), % 0
0 to 0.1
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
2.8 to 3.2
Cadmium (Cd), % 0
0 to 0.0020
Copper (Cu), % 46 to 50
0 to 0.050
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0
0 to 0.020
Lead (Pb), % 0 to 0.050
0 to 0.070
Nickel (Ni), % 9.0 to 11
0 to 0.010
Phosphorus (P), % 0 to 0.25
0
Silicon (Si), % 0.040 to 0.25
0
Silver (Ag), % 0
0 to 0.1
Tin (Sn), % 0
87.8 to 89.7
Zinc (Zn), % 37.9 to 45
7.5 to 8.5
Residuals, % 0 to 0.5
0