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C78200 Nickel Silver vs. Solder Alloy 123

C78200 nickel silver belongs to the copper alloys classification, while solder alloy 123 belongs to the otherwise unclassified metals. There are 24 material properties with values for both materials. Properties with values for just one material (8, in this case) are not shown.

For each property being compared, the top bar is C78200 nickel silver and the bottom bar is solder alloy 123.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 110
18
Elongation at Break, % 3.0 to 40
45
Poisson's Ratio 0.32
0.44
Shear Modulus, GPa 43
6.2
Tensile Strength: Ultimate (UTS), MPa 370 to 630
28

Thermal Properties

Latent Heat of Fusion, J/g 190
26
Melting Completion (Liquidus), °C 1000
310
Melting Onset (Solidus), °C 970
300
Specific Heat Capacity, J/kg-K 390
130
Thermal Conductivity, W/m-K 48
23
Thermal Expansion, µm/m-K 19
29

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 11
8.8
Electrical Conductivity: Equal Weight (Specific), % IACS 12
7.1

Otherwise Unclassified Properties

Base Metal Price, % relative 28
75
Density, g/cm3 8.4
11
Embodied Carbon, kg CO2/kg material 3.3
4.5
Embodied Energy, MJ/kg 52
74
Embodied Water, L/kg 310
500

Common Calculations

Stiffness to Weight: Axial, points 7.4
0.9
Stiffness to Weight: Bending, points 19
7.8
Strength to Weight: Axial, points 12 to 21
0.69
Strength to Weight: Bending, points 14 to 19
1.8
Thermal Diffusivity, mm2/s 15
16
Thermal Shock Resistance, points 12 to 21
3.8

Alloy Composition

Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0
0 to 0.5
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.1
Cadmium (Cd), % 0
0 to 0.0050
Copper (Cu), % 63 to 67
0 to 0.080
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0 to 0.35
0 to 0.020
Lead (Pb), % 1.5 to 2.5
93.5 to 95.5
Manganese (Mn), % 0 to 0.5
0
Nickel (Ni), % 7.0 to 9.0
0 to 0.010
Silver (Ag), % 0
0 to 0.1
Tin (Sn), % 0
4.5 to 5.5
Zinc (Zn), % 20.2 to 28.5
0 to 0.0010
Residuals, % 0 to 0.5
0