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C81400 Copper vs. Solder Alloy 191

C81400 copper belongs to the copper alloys classification, while solder alloy 191 belongs to the otherwise unclassified metals. There are 22 material properties with values for both materials. Properties with values for just one material (7, in this case) are not shown.

For each property being compared, the top bar is C81400 copper and the bottom bar is solder alloy 191.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
19
Elongation at Break, % 11
32
Poisson's Ratio 0.34
0.43
Shear Modulus, GPa 41
6.5
Tensile Strength: Ultimate (UTS), MPa 370
29

Thermal Properties

Latent Heat of Fusion, J/g 210
27
Melting Completion (Liquidus), °C 1090
300
Melting Onset (Solidus), °C 1070
300
Specific Heat Capacity, J/kg-K 390
130
Thermal Conductivity, W/m-K 260
24
Thermal Expansion, µm/m-K 17
29

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 60
8.8
Electrical Conductivity: Equal Weight (Specific), % IACS 61
7.2

Otherwise Unclassified Properties

Density, g/cm3 8.9
11
Embodied Carbon, kg CO2/kg material 2.8
5.8
Embodied Energy, MJ/kg 45
95

Common Calculations

Stiffness to Weight: Axial, points 7.3
0.93
Stiffness to Weight: Bending, points 18
8.0
Strength to Weight: Axial, points 11
0.72
Strength to Weight: Bending, points 13
1.9
Thermal Diffusivity, mm2/s 75
16
Thermal Shock Resistance, points 13
3.9

Alloy Composition

Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0
0 to 0.2
Arsenic (As), % 0
0 to 0.030
Beryllium (Be), % 0.020 to 0.1
0
Bismuth (Bi), % 0
0 to 0.1
Cadmium (Cd), % 0
0 to 0.0020
Chromium (Cr), % 0.6 to 1.0
0
Copper (Cu), % 98.4 to 99.38
0 to 0.080
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0
0 to 0.020
Lead (Pb), % 0
92.4 to 94
Nickel (Ni), % 0
0 to 0.010
Silver (Ag), % 0
1.2 to 1.8
Tin (Sn), % 0
4.8 to 5.2
Zinc (Zn), % 0
0 to 0.0010
Residuals, % 0 to 0.5
0