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C81500 Copper vs. Solder Alloy 102

C81500 copper belongs to the copper alloys classification, while solder alloy 102 belongs to the otherwise unclassified metals. There are 23 material properties with values for both materials. Properties with values for just one material (6, in this case) are not shown.

For each property being compared, the top bar is C81500 copper and the bottom bar is solder alloy 102.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
38
Elongation at Break, % 17
48
Poisson's Ratio 0.34
0.39
Shear Modulus, GPa 44
14
Tensile Strength: Ultimate (UTS), MPa 350
31

Thermal Properties

Latent Heat of Fusion, J/g 210
46
Melting Completion (Liquidus), °C 1090
180
Melting Onset (Solidus), °C 1080
180
Specific Heat Capacity, J/kg-K 390
190
Thermal Conductivity, W/m-K 320
53
Thermal Expansion, µm/m-K 17
25

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 82
12
Electrical Conductivity: Equal Weight (Specific), % IACS 83
13

Otherwise Unclassified Properties

Density, g/cm3 8.9
8.8
Embodied Carbon, kg CO2/kg material 2.6
11
Embodied Energy, MJ/kg 41
180
Embodied Water, L/kg 310
930

Common Calculations

Stiffness to Weight: Axial, points 7.3
2.4
Stiffness to Weight: Bending, points 18
13
Strength to Weight: Axial, points 11
1.0
Strength to Weight: Bending, points 12
2.5
Thermal Diffusivity, mm2/s 91
32
Thermal Shock Resistance, points 12
2.4

Alloy Composition

Aluminum (Al), % 0 to 0.1
0 to 0.0010
Antimony (Sb), % 0
0 to 0.050
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.050
Cadmium (Cd), % 0
0 to 0.0020
Chromium (Cr), % 0.4 to 1.5
0
Copper (Cu), % 97.4 to 99.6
0 to 0.080
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0 to 0.1
0 to 0.020
Lead (Pb), % 0 to 0.020
36 to 37.5
Nickel (Ni), % 0
0 to 0.010
Silicon (Si), % 0 to 0.15
0
Silver (Ag), % 0
0 to 0.1
Tin (Sn), % 0 to 0.1
62.5 to 63.5
Zinc (Zn), % 0 to 0.1
0 to 0.0010
Residuals, % 0 to 0.5
0