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C81500 Copper vs. Solder Alloy 104

C81500 copper belongs to the copper alloys classification, while solder alloy 104 belongs to the otherwise unclassified metals. There are 23 material properties with values for both materials. Properties with values for just one material (6, in this case) are not shown.

For each property being compared, the top bar is C81500 copper and the bottom bar is solder alloy 104.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
37
Elongation at Break, % 17
46
Poisson's Ratio 0.34
0.39
Shear Modulus, GPa 44
13
Tensile Strength: Ultimate (UTS), MPa 350
51

Thermal Properties

Latent Heat of Fusion, J/g 210
45
Melting Completion (Liquidus), °C 1090
190
Melting Onset (Solidus), °C 1080
180
Specific Heat Capacity, J/kg-K 390
180
Thermal Conductivity, W/m-K 320
50
Thermal Expansion, µm/m-K 17
25

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 82
11
Electrical Conductivity: Equal Weight (Specific), % IACS 83
11

Otherwise Unclassified Properties

Density, g/cm3 8.9
8.9
Embodied Carbon, kg CO2/kg material 2.6
10
Embodied Energy, MJ/kg 41
180
Embodied Water, L/kg 310
900

Common Calculations

Stiffness to Weight: Axial, points 7.3
2.3
Stiffness to Weight: Bending, points 18
12
Strength to Weight: Axial, points 11
1.6
Strength to Weight: Bending, points 12
3.4
Thermal Diffusivity, mm2/s 91
30
Thermal Shock Resistance, points 12
4.0

Alloy Composition

Aluminum (Al), % 0 to 0.1
0 to 0.0010
Antimony (Sb), % 0
0 to 0.050
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.050
Cadmium (Cd), % 0
0 to 0.0020
Chromium (Cr), % 0.4 to 1.5
0
Copper (Cu), % 97.4 to 99.6
0 to 0.080
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0 to 0.1
0 to 0.020
Lead (Pb), % 0 to 0.020
39 to 40.5
Nickel (Ni), % 0
0 to 0.010
Silicon (Si), % 0 to 0.15
0
Silver (Ag), % 0
0 to 0.1
Tin (Sn), % 0 to 0.1
59.5 to 60.5
Zinc (Zn), % 0 to 0.1
0 to 0.0010
Residuals, % 0 to 0.5
0