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C81500 Copper vs. Solder Alloy 122

C81500 copper belongs to the copper alloys classification, while solder alloy 122 belongs to the otherwise unclassified metals. There are 25 material properties with values for both materials. Properties with values for just one material (4, in this case) are not shown.

For each property being compared, the top bar is C81500 copper and the bottom bar is solder alloy 122.

Metric UnitsUS Customary Units

Mechanical Properties

Brinell Hardness 110
10
Elastic (Young's, Tensile) Modulus, GPa 120
20
Elongation at Break, % 17
30
Poisson's Ratio 0.34
0.43
Shear Modulus, GPa 44
6.9
Tensile Strength: Ultimate (UTS), MPa 350
30

Thermal Properties

Latent Heat of Fusion, J/g 210
27
Melting Completion (Liquidus), °C 1090
300
Melting Onset (Solidus), °C 1080
270
Specific Heat Capacity, J/kg-K 390
140
Thermal Conductivity, W/m-K 320
25
Thermal Expansion, µm/m-K 17
28

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 82
8.9
Electrical Conductivity: Equal Weight (Specific), % IACS 83
7.3

Otherwise Unclassified Properties

Base Metal Price, % relative 31
75
Density, g/cm3 8.9
11
Embodied Carbon, kg CO2/kg material 2.6
5.0
Embodied Energy, MJ/kg 41
84
Embodied Water, L/kg 310
540

Common Calculations

Stiffness to Weight: Axial, points 7.3
1.0
Stiffness to Weight: Bending, points 18
8.2
Strength to Weight: Axial, points 11
0.77
Strength to Weight: Bending, points 12
2.0
Thermal Diffusivity, mm2/s 91
17
Thermal Shock Resistance, points 12
3.9

Alloy Composition

Aluminum (Al), % 0 to 0.1
0 to 0.0010
Antimony (Sb), % 0
0 to 0.5
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.25
Cadmium (Cd), % 0
0 to 0.0050
Chromium (Cr), % 0.4 to 1.5
0
Copper (Cu), % 97.4 to 99.6
0 to 0.080
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0 to 0.1
0 to 0.020
Lead (Pb), % 0 to 0.020
88.4 to 90.5
Nickel (Ni), % 0
0 to 0.010
Silicon (Si), % 0 to 0.15
0
Silver (Ag), % 0
0 to 0.1
Tin (Sn), % 0 to 0.1
9.5 to 10.5
Zinc (Zn), % 0 to 0.1
0 to 0.0010
Residuals, % 0 to 0.5
0