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C81500 Copper vs. Solder Alloy 123

C81500 copper belongs to the copper alloys classification, while solder alloy 123 belongs to the otherwise unclassified metals. There are 25 material properties with values for both materials. Properties with values for just one material (4, in this case) are not shown.

For each property being compared, the top bar is C81500 copper and the bottom bar is solder alloy 123.

Metric UnitsUS Customary Units

Mechanical Properties

Brinell Hardness 110
8.0
Elastic (Young's, Tensile) Modulus, GPa 120
18
Elongation at Break, % 17
45
Poisson's Ratio 0.34
0.44
Shear Modulus, GPa 44
6.2
Tensile Strength: Ultimate (UTS), MPa 350
28

Thermal Properties

Latent Heat of Fusion, J/g 210
26
Melting Completion (Liquidus), °C 1090
310
Melting Onset (Solidus), °C 1080
300
Specific Heat Capacity, J/kg-K 390
130
Thermal Conductivity, W/m-K 320
23
Thermal Expansion, µm/m-K 17
29

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 82
8.8
Electrical Conductivity: Equal Weight (Specific), % IACS 83
7.1

Otherwise Unclassified Properties

Base Metal Price, % relative 31
75
Density, g/cm3 8.9
11
Embodied Carbon, kg CO2/kg material 2.6
4.5
Embodied Energy, MJ/kg 41
74
Embodied Water, L/kg 310
500

Common Calculations

Stiffness to Weight: Axial, points 7.3
0.9
Stiffness to Weight: Bending, points 18
7.8
Strength to Weight: Axial, points 11
0.69
Strength to Weight: Bending, points 12
1.8
Thermal Diffusivity, mm2/s 91
16
Thermal Shock Resistance, points 12
3.8

Alloy Composition

Aluminum (Al), % 0 to 0.1
0 to 0.0010
Antimony (Sb), % 0
0 to 0.5
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.1
Cadmium (Cd), % 0
0 to 0.0050
Chromium (Cr), % 0.4 to 1.5
0
Copper (Cu), % 97.4 to 99.6
0 to 0.080
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0 to 0.1
0 to 0.020
Lead (Pb), % 0 to 0.020
93.5 to 95.5
Nickel (Ni), % 0
0 to 0.010
Silicon (Si), % 0 to 0.15
0
Silver (Ag), % 0
0 to 0.1
Tin (Sn), % 0 to 0.1
4.5 to 5.5
Zinc (Zn), % 0 to 0.1
0 to 0.0010
Residuals, % 0 to 0.5
0