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C81500 Copper vs. Solder Alloy 141

C81500 copper belongs to the copper alloys classification, while solder alloy 141 belongs to the otherwise unclassified metals. There are 23 material properties with values for both materials. Properties with values for just one material (6, in this case) are not shown.

For each property being compared, the top bar is C81500 copper and the bottom bar is solder alloy 141.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
37
Elongation at Break, % 17
39
Poisson's Ratio 0.34
0.39
Shear Modulus, GPa 44
13
Tensile Strength: Ultimate (UTS), MPa 350
54

Thermal Properties

Latent Heat of Fusion, J/g 210
46
Melting Completion (Liquidus), °C 1090
190
Melting Onset (Solidus), °C 1080
180
Specific Heat Capacity, J/kg-K 390
180
Thermal Conductivity, W/m-K 320
48
Thermal Expansion, µm/m-K 17
24

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 82
10
Electrical Conductivity: Equal Weight (Specific), % IACS 83
10

Otherwise Unclassified Properties

Density, g/cm3 8.9
8.9
Embodied Carbon, kg CO2/kg material 2.6
11
Embodied Energy, MJ/kg 41
180
Embodied Water, L/kg 310
970

Common Calculations

Stiffness to Weight: Axial, points 7.3
2.3
Stiffness to Weight: Bending, points 18
13
Strength to Weight: Axial, points 11
1.7
Strength to Weight: Bending, points 12
3.6
Thermal Diffusivity, mm2/s 91
29
Thermal Shock Resistance, points 12
4.3

Alloy Composition

Aluminum (Al), % 0 to 0.1
0 to 0.0010
Antimony (Sb), % 0
0 to 0.2
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
2.0 to 3.0
Cadmium (Cd), % 0
0 to 0.0020
Chromium (Cr), % 0.4 to 1.5
0
Copper (Cu), % 97.4 to 99.6
0 to 0.080
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0 to 0.1
0 to 0.020
Lead (Pb), % 0 to 0.020
35.9 to 38.5
Nickel (Ni), % 0
0 to 0.010
Silicon (Si), % 0 to 0.15
0
Silver (Ag), % 0
0 to 0.1
Tin (Sn), % 0 to 0.1
59.5 to 60.5
Zinc (Zn), % 0 to 0.1
0 to 0.0010
Residuals, % 0 to 0.5
0