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C81500 Copper vs. Solder Alloy 601

C81500 copper belongs to the copper alloys classification, while solder alloy 601 belongs to the otherwise unclassified metals. There are 22 material properties with values for both materials. Properties with values for just one material (7, in this case) are not shown.

For each property being compared, the top bar is C81500 copper and the bottom bar is solder alloy 601.

Metric UnitsUS Customary Units

Mechanical Properties

Brinell Hardness 110
5.0
Elastic (Young's, Tensile) Modulus, GPa 120
31
Elongation at Break, % 17
83
Poisson's Ratio 0.34
0.41
Shear Modulus, GPa 44
11
Tensile Strength: Ultimate (UTS), MPa 350
12

Thermal Properties

Latent Heat of Fusion, J/g 210
43
Melting Completion (Liquidus), °C 1090
120
Melting Onset (Solidus), °C 1080
120
Specific Heat Capacity, J/kg-K 390
230
Thermal Conductivity, W/m-K 320
34
Thermal Expansion, µm/m-K 17
23

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 82
12
Electrical Conductivity: Equal Weight (Specific), % IACS 83
14

Otherwise Unclassified Properties

Density, g/cm3 8.9
7.3
Embodied Water, L/kg 310
1330

Common Calculations

Stiffness to Weight: Axial, points 7.3
2.3
Stiffness to Weight: Bending, points 18
14
Strength to Weight: Axial, points 11
0.45
Strength to Weight: Bending, points 12
1.6
Thermal Diffusivity, mm2/s 91
20
Thermal Shock Resistance, points 12
1.2

Alloy Composition

Aluminum (Al), % 0 to 0.1
0 to 0.0010
Antimony (Sb), % 0
0 to 0.1
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.1
Cadmium (Cd), % 0
0 to 0.0020
Chromium (Cr), % 0.4 to 1.5
0
Copper (Cu), % 97.4 to 99.6
0 to 0.050
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
51 to 52.5
Iron (Fe), % 0 to 0.1
0 to 0.020
Lead (Pb), % 0 to 0.020
0 to 0.070
Nickel (Ni), % 0
0 to 0.010
Silicon (Si), % 0 to 0.15
0
Silver (Ag), % 0
0 to 0.1
Tin (Sn), % 0 to 0.1
47.5 to 48.5
Zinc (Zn), % 0 to 0.1
0 to 0.0010
Residuals, % 0 to 0.5
0