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C81500 Copper vs. Solder Alloy 714

C81500 copper belongs to the copper alloys classification, while solder alloy 714 belongs to the otherwise unclassified metals. There are 23 material properties with values for both materials. Properties with values for just one material (6, in this case) are not shown.

For each property being compared, the top bar is C81500 copper and the bottom bar is solder alloy 714.

Metric UnitsUS Customary Units

Mechanical Properties

Brinell Hardness 110
15
Elastic (Young's, Tensile) Modulus, GPa 120
51
Elongation at Break, % 17
17
Poisson's Ratio 0.34
0.36
Shear Modulus, GPa 44
19
Tensile Strength: Ultimate (UTS), MPa 350
52

Thermal Properties

Latent Heat of Fusion, J/g 210
62
Melting Completion (Liquidus), °C 1090
220
Melting Onset (Solidus), °C 1080
220
Specific Heat Capacity, J/kg-K 390
220
Thermal Conductivity, W/m-K 320
62
Thermal Expansion, µm/m-K 17
22

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 82
13
Electrical Conductivity: Equal Weight (Specific), % IACS 83
16

Otherwise Unclassified Properties

Density, g/cm3 8.9
7.4
Embodied Carbon, kg CO2/kg material 2.6
18
Embodied Energy, MJ/kg 41
300

Common Calculations

Stiffness to Weight: Axial, points 7.3
3.8
Stiffness to Weight: Bending, points 18
17
Strength to Weight: Axial, points 11
1.9
Strength to Weight: Bending, points 12
4.2
Thermal Diffusivity, mm2/s 91
37
Thermal Shock Resistance, points 12
3.3

Alloy Composition

Aluminum (Al), % 0 to 0.1
0 to 0.0010
Antimony (Sb), % 0
0 to 0.1
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.1
Cadmium (Cd), % 0
0 to 0.0020
Chromium (Cr), % 0.4 to 1.5
0
Copper (Cu), % 97.4 to 99.6
0.3 to 0.7
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0 to 0.1
0 to 0.020
Lead (Pb), % 0 to 0.020
0 to 0.070
Nickel (Ni), % 0
0 to 0.010
Silicon (Si), % 0 to 0.15
0
Silver (Ag), % 0
3.8 to 4.2
Tin (Sn), % 0 to 0.1
94.6 to 95.9
Zinc (Zn), % 0 to 0.1
0 to 0.0010
Residuals, % 0 to 0.5
0