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C82000 Copper vs. CC382H Copper-nickel

Both C82000 copper and CC382H copper-nickel are copper alloys. They have 66% of their average alloy composition in common. There are 28 material properties with values for both materials. Properties with values for just one material (2, in this case) are not shown.

For each property being compared, the top bar is C82000 copper and the bottom bar is CC382H copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
140
Elongation at Break, % 8.0 to 20
20
Poisson's Ratio 0.34
0.33
Shear Modulus, GPa 45
53
Tensile Strength: Ultimate (UTS), MPa 350 to 690
490
Tensile Strength: Yield (Proof), MPa 140 to 520
290

Thermal Properties

Latent Heat of Fusion, J/g 220
240
Maximum Temperature: Mechanical, °C 220
260
Melting Completion (Liquidus), °C 1090
1180
Melting Onset (Solidus), °C 970
1120
Specific Heat Capacity, J/kg-K 390
410
Thermal Conductivity, W/m-K 260
30
Thermal Expansion, µm/m-K 17
15

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 45
5.5
Electrical Conductivity: Equal Weight (Specific), % IACS 46
5.6

Otherwise Unclassified Properties

Base Metal Price, % relative 60
41
Density, g/cm3 8.9
8.9
Embodied Carbon, kg CO2/kg material 5.0
5.2
Embodied Energy, MJ/kg 77
76
Embodied Water, L/kg 320
290

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 51 to 55
85
Resilience: Unit (Modulus of Resilience), kJ/m3 80 to 1120
290
Stiffness to Weight: Axial, points 7.5
8.8
Stiffness to Weight: Bending, points 18
20
Strength to Weight: Axial, points 11 to 22
15
Strength to Weight: Bending, points 12 to 20
16
Thermal Diffusivity, mm2/s 76
8.2
Thermal Shock Resistance, points 12 to 24
16

Alloy Composition

Aluminum (Al), % 0 to 0.1
0 to 0.010
Beryllium (Be), % 0.45 to 0.8
0
Bismuth (Bi), % 0
0 to 0.0020
Boron (B), % 0
0 to 0.010
Carbon (C), % 0
0 to 0.030
Chromium (Cr), % 0 to 0.1
1.5 to 2.0
Cobalt (Co), % 2.2 to 2.7
0
Copper (Cu), % 95.2 to 97.4
62.8 to 68.4
Iron (Fe), % 0 to 0.1
0.5 to 1.0
Lead (Pb), % 0 to 0.020
0 to 0.0050
Magnesium (Mg), % 0
0 to 0.010
Manganese (Mn), % 0
0.5 to 1.0
Nickel (Ni), % 0 to 0.2
29 to 32
Phosphorus (P), % 0
0 to 0.010
Selenium (Se), % 0
0 to 0.0050
Silicon (Si), % 0 to 0.15
0.15 to 0.5
Sulfur (S), % 0
0 to 0.010
Tellurium (Te), % 0
0 to 0.0050
Tin (Sn), % 0 to 0.1
0
Titanium (Ti), % 0
0 to 0.25
Zinc (Zn), % 0 to 0.1
0 to 0.2
Zirconium (Zr), % 0
0 to 0.15
Residuals, % 0 to 0.5
0