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C82000 Copper vs. C23000 Brass

Both C82000 copper and C23000 brass are copper alloys. They have 85% of their average alloy composition in common. There are 29 material properties with values for both materials. Properties with values for just one material (3, in this case) are not shown.

For each property being compared, the top bar is C82000 copper and the bottom bar is C23000 brass.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
110
Elongation at Break, % 8.0 to 20
2.9 to 47
Poisson's Ratio 0.34
0.33
Rockwell B Hardness 55 to 95
48 to 87
Shear Modulus, GPa 45
42
Tensile Strength: Ultimate (UTS), MPa 350 to 690
280 to 590
Tensile Strength: Yield (Proof), MPa 140 to 520
83 to 480

Thermal Properties

Latent Heat of Fusion, J/g 220
190
Maximum Temperature: Mechanical, °C 220
170
Melting Completion (Liquidus), °C 1090
1030
Melting Onset (Solidus), °C 970
990
Specific Heat Capacity, J/kg-K 390
390
Thermal Conductivity, W/m-K 260
160
Thermal Expansion, µm/m-K 17
19

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 45
37
Electrical Conductivity: Equal Weight (Specific), % IACS 46
39

Otherwise Unclassified Properties

Base Metal Price, % relative 60
28
Density, g/cm3 8.9
8.6
Embodied Carbon, kg CO2/kg material 5.0
2.6
Embodied Energy, MJ/kg 77
43
Embodied Water, L/kg 320
310

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 51 to 55
6.2 to 260
Resilience: Unit (Modulus of Resilience), kJ/m3 80 to 1120
31 to 1040
Stiffness to Weight: Axial, points 7.5
7.2
Stiffness to Weight: Bending, points 18
19
Strength to Weight: Axial, points 11 to 22
8.9 to 19
Strength to Weight: Bending, points 12 to 20
11 to 18
Thermal Diffusivity, mm2/s 76
48
Thermal Shock Resistance, points 12 to 24
9.4 to 20

Alloy Composition

Aluminum (Al), % 0 to 0.1
0
Beryllium (Be), % 0.45 to 0.8
0
Chromium (Cr), % 0 to 0.1
0
Cobalt (Co), % 2.2 to 2.7
0
Copper (Cu), % 95.2 to 97.4
84 to 86
Iron (Fe), % 0 to 0.1
0 to 0.050
Lead (Pb), % 0 to 0.020
0 to 0.050
Nickel (Ni), % 0 to 0.2
0
Silicon (Si), % 0 to 0.15
0
Tin (Sn), % 0 to 0.1
0
Zinc (Zn), % 0 to 0.1
13.7 to 16
Residuals, % 0
0 to 0.2