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C82000 Copper vs. C42600 Brass

Both C82000 copper and C42600 brass are copper alloys. They have 89% of their average alloy composition in common. There are 28 material properties with values for both materials. Properties with values for just one material (2, in this case) are not shown.

For each property being compared, the top bar is C82000 copper and the bottom bar is C42600 brass.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
110
Elongation at Break, % 8.0 to 20
1.1 to 40
Poisson's Ratio 0.34
0.33
Shear Modulus, GPa 45
42
Tensile Strength: Ultimate (UTS), MPa 350 to 690
410 to 830
Tensile Strength: Yield (Proof), MPa 140 to 520
220 to 810

Thermal Properties

Latent Heat of Fusion, J/g 220
200
Maximum Temperature: Mechanical, °C 220
180
Melting Completion (Liquidus), °C 1090
1030
Melting Onset (Solidus), °C 970
1010
Specific Heat Capacity, J/kg-K 390
380
Thermal Conductivity, W/m-K 260
110
Thermal Expansion, µm/m-K 17
18

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 45
25
Electrical Conductivity: Equal Weight (Specific), % IACS 46
26

Otherwise Unclassified Properties

Base Metal Price, % relative 60
31
Density, g/cm3 8.9
8.7
Embodied Carbon, kg CO2/kg material 5.0
2.9
Embodied Energy, MJ/kg 77
48
Embodied Water, L/kg 320
340

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 51 to 55
9.4 to 140
Resilience: Unit (Modulus of Resilience), kJ/m3 80 to 1120
230 to 2970
Stiffness to Weight: Axial, points 7.5
7.1
Stiffness to Weight: Bending, points 18
18
Strength to Weight: Axial, points 11 to 22
13 to 27
Strength to Weight: Bending, points 12 to 20
14 to 23
Thermal Diffusivity, mm2/s 76
33
Thermal Shock Resistance, points 12 to 24
15 to 29

Alloy Composition

Aluminum (Al), % 0 to 0.1
0
Beryllium (Be), % 0.45 to 0.8
0
Chromium (Cr), % 0 to 0.1
0
Cobalt (Co), % 2.2 to 2.7
0
Copper (Cu), % 95.2 to 97.4
87 to 90
Iron (Fe), % 0 to 0.1
0.050 to 0.2
Lead (Pb), % 0 to 0.020
0 to 0.050
Nickel (Ni), % 0 to 0.2
0.050 to 0.2
Phosphorus (P), % 0
0.020 to 0.050
Silicon (Si), % 0 to 0.15
0
Tin (Sn), % 0 to 0.1
2.5 to 4.0
Zinc (Zn), % 0 to 0.1
5.3 to 10.4
Residuals, % 0
0 to 0.2