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C82200 Copper vs. ASTM A387 Grade 21 Steel

C82200 copper belongs to the copper alloys classification, while ASTM A387 grade 21 steel belongs to the iron alloys. There are 28 material properties with values for both materials. Properties with values for just one material (5, in this case) are not shown.

For each property being compared, the top bar is C82200 copper and the bottom bar is ASTM A387 grade 21 steel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
190
Elongation at Break, % 8.0 to 20
21
Poisson's Ratio 0.34
0.29
Shear Modulus, GPa 44
74
Tensile Strength: Ultimate (UTS), MPa 390 to 660
500 to 590
Tensile Strength: Yield (Proof), MPa 210 to 520
230 to 350

Thermal Properties

Latent Heat of Fusion, J/g 220
260
Maximum Temperature: Mechanical, °C 230
480
Melting Completion (Liquidus), °C 1080
1470
Melting Onset (Solidus), °C 1040
1430
Specific Heat Capacity, J/kg-K 390
470
Thermal Conductivity, W/m-K 180
41
Thermal Expansion, µm/m-K 17
13

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 45
7.6
Electrical Conductivity: Equal Weight (Specific), % IACS 46
8.8

Otherwise Unclassified Properties

Base Metal Price, % relative 55
4.1
Density, g/cm3 8.9
7.9
Embodied Carbon, kg CO2/kg material 4.8
1.8
Embodied Energy, MJ/kg 74
23
Embodied Water, L/kg 310
62

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 49 to 66
84 to 110
Resilience: Unit (Modulus of Resilience), kJ/m3 180 to 1130
140 to 320
Stiffness to Weight: Axial, points 7.4
13
Stiffness to Weight: Bending, points 18
24
Strength to Weight: Axial, points 12 to 20
18 to 21
Strength to Weight: Bending, points 13 to 19
18 to 20
Thermal Diffusivity, mm2/s 53
11
Thermal Shock Resistance, points 14 to 23
14 to 17

Alloy Composition

Beryllium (Be), % 0.35 to 0.8
0
Carbon (C), % 0
0.050 to 0.15
Chromium (Cr), % 0
2.8 to 3.3
Cobalt (Co), % 0 to 0.3
0
Copper (Cu), % 97.4 to 98.7
0
Iron (Fe), % 0
94.4 to 96
Manganese (Mn), % 0
0.3 to 0.6
Molybdenum (Mo), % 0
0.9 to 1.1
Nickel (Ni), % 1.0 to 2.0
0
Phosphorus (P), % 0
0 to 0.025
Silicon (Si), % 0
0 to 0.5
Sulfur (S), % 0
0 to 0.025
Residuals, % 0 to 0.5
0