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C82200 Copper vs. CC381H Copper-nickel

Both C82200 copper and CC381H copper-nickel are copper alloys. They have 69% of their average alloy composition in common. There are 28 material properties with values for both materials. Properties with values for just one material (2, in this case) are not shown.

For each property being compared, the top bar is C82200 copper and the bottom bar is CC381H copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
140
Elongation at Break, % 8.0 to 20
20
Poisson's Ratio 0.34
0.33
Shear Modulus, GPa 44
52
Tensile Strength: Ultimate (UTS), MPa 390 to 660
380
Tensile Strength: Yield (Proof), MPa 210 to 520
140

Thermal Properties

Latent Heat of Fusion, J/g 220
240
Maximum Temperature: Mechanical, °C 230
260
Melting Completion (Liquidus), °C 1080
1180
Melting Onset (Solidus), °C 1040
1120
Specific Heat Capacity, J/kg-K 390
410
Thermal Conductivity, W/m-K 180
30
Thermal Expansion, µm/m-K 17
16

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 45
6.8
Electrical Conductivity: Equal Weight (Specific), % IACS 46
6.9

Otherwise Unclassified Properties

Base Metal Price, % relative 55
40
Density, g/cm3 8.9
8.9
Embodied Carbon, kg CO2/kg material 4.8
5.0
Embodied Energy, MJ/kg 74
73
Embodied Water, L/kg 310
280

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 49 to 66
60
Resilience: Unit (Modulus of Resilience), kJ/m3 180 to 1130
68
Stiffness to Weight: Axial, points 7.4
8.6
Stiffness to Weight: Bending, points 18
19
Strength to Weight: Axial, points 12 to 20
12
Strength to Weight: Bending, points 13 to 19
13
Thermal Diffusivity, mm2/s 53
8.4
Thermal Shock Resistance, points 14 to 23
13

Alloy Composition

Aluminum (Al), % 0
0 to 0.010
Beryllium (Be), % 0.35 to 0.8
0
Carbon (C), % 0
0 to 0.030
Cobalt (Co), % 0 to 0.3
0
Copper (Cu), % 97.4 to 98.7
64.5 to 69.9
Iron (Fe), % 0
0.5 to 1.5
Lead (Pb), % 0
0 to 0.030
Manganese (Mn), % 0
0.6 to 1.2
Nickel (Ni), % 1.0 to 2.0
29 to 31
Phosphorus (P), % 0
0 to 0.010
Silicon (Si), % 0
0 to 0.1
Sulfur (S), % 0
0 to 0.010
Zinc (Zn), % 0
0 to 0.5
Residuals, % 0 to 0.5
0