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C82200 Copper vs. C49300 Brass

Both C82200 copper and C49300 brass are copper alloys. They have 61% of their average alloy composition in common. There are 28 material properties with values for both materials. Properties with values for just one material (2, in this case) are not shown.

For each property being compared, the top bar is C82200 copper and the bottom bar is C49300 brass.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
100
Elongation at Break, % 8.0 to 20
4.5 to 20
Poisson's Ratio 0.34
0.31
Shear Modulus, GPa 44
40
Tensile Strength: Ultimate (UTS), MPa 390 to 660
430 to 520
Tensile Strength: Yield (Proof), MPa 210 to 520
210 to 410

Thermal Properties

Latent Heat of Fusion, J/g 220
170
Maximum Temperature: Mechanical, °C 230
120
Melting Completion (Liquidus), °C 1080
880
Melting Onset (Solidus), °C 1040
840
Specific Heat Capacity, J/kg-K 390
380
Thermal Conductivity, W/m-K 180
88
Thermal Expansion, µm/m-K 17
20

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 45
15
Electrical Conductivity: Equal Weight (Specific), % IACS 46
17

Otherwise Unclassified Properties

Base Metal Price, % relative 55
26
Density, g/cm3 8.9
8.0
Embodied Carbon, kg CO2/kg material 4.8
3.0
Embodied Energy, MJ/kg 74
50
Embodied Water, L/kg 310
370

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 49 to 66
21 to 71
Resilience: Unit (Modulus of Resilience), kJ/m3 180 to 1130
220 to 800
Stiffness to Weight: Axial, points 7.4
7.2
Stiffness to Weight: Bending, points 18
19
Strength to Weight: Axial, points 12 to 20
15 to 18
Strength to Weight: Bending, points 13 to 19
16 to 18
Thermal Diffusivity, mm2/s 53
29
Thermal Shock Resistance, points 14 to 23
14 to 18

Alloy Composition

Aluminum (Al), % 0
0 to 0.5
Antimony (Sb), % 0
0 to 0.5
Beryllium (Be), % 0.35 to 0.8
0
Bismuth (Bi), % 0
0.5 to 2.0
Cobalt (Co), % 0 to 0.3
0
Copper (Cu), % 97.4 to 98.7
58 to 62
Iron (Fe), % 0
0 to 0.1
Lead (Pb), % 0
0 to 0.010
Manganese (Mn), % 0
0 to 0.030
Nickel (Ni), % 1.0 to 2.0
0 to 1.5
Phosphorus (P), % 0
0 to 0.2
Selenium (Se), % 0
0 to 0.2
Silicon (Si), % 0
0 to 0.1
Tin (Sn), % 0
1.0 to 1.8
Zinc (Zn), % 0
30.6 to 40.5
Residuals, % 0
0 to 0.5