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C82200 Copper vs. N10665 Nickel

C82200 copper belongs to the copper alloys classification, while N10665 nickel belongs to the nickel alloys. There are 29 material properties with values for both materials. Properties with values for just one material (2, in this case) are not shown.

For each property being compared, the top bar is C82200 copper and the bottom bar is N10665 nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
220
Elongation at Break, % 8.0 to 20
45
Poisson's Ratio 0.34
0.31
Rockwell B Hardness 60 to 96
86
Shear Modulus, GPa 44
84
Tensile Strength: Ultimate (UTS), MPa 390 to 660
860
Tensile Strength: Yield (Proof), MPa 210 to 520
400

Thermal Properties

Latent Heat of Fusion, J/g 220
310
Maximum Temperature: Mechanical, °C 230
900
Melting Completion (Liquidus), °C 1080
1620
Melting Onset (Solidus), °C 1040
1570
Specific Heat Capacity, J/kg-K 390
390
Thermal Conductivity, W/m-K 180
11
Thermal Expansion, µm/m-K 17
10

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 45
1.3
Electrical Conductivity: Equal Weight (Specific), % IACS 46
1.2

Otherwise Unclassified Properties

Base Metal Price, % relative 55
75
Density, g/cm3 8.9
9.3
Embodied Carbon, kg CO2/kg material 4.8
15
Embodied Energy, MJ/kg 74
200
Embodied Water, L/kg 310
270

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 49 to 66
320
Resilience: Unit (Modulus of Resilience), kJ/m3 180 to 1130
360
Stiffness to Weight: Axial, points 7.4
13
Stiffness to Weight: Bending, points 18
22
Strength to Weight: Axial, points 12 to 20
26
Strength to Weight: Bending, points 13 to 19
22
Thermal Diffusivity, mm2/s 53
3.1
Thermal Shock Resistance, points 14 to 23
27

Alloy Composition

Beryllium (Be), % 0.35 to 0.8
0
Carbon (C), % 0
0 to 0.020
Chromium (Cr), % 0
0 to 1.0
Cobalt (Co), % 0 to 0.3
0 to 1.0
Copper (Cu), % 97.4 to 98.7
0
Iron (Fe), % 0
0 to 2.0
Manganese (Mn), % 0
0 to 1.0
Molybdenum (Mo), % 0
26 to 30
Nickel (Ni), % 1.0 to 2.0
64.8 to 74
Phosphorus (P), % 0
0 to 0.040
Silicon (Si), % 0
0 to 0.1
Sulfur (S), % 0
0 to 0.030
Residuals, % 0 to 0.5
0