MakeItFrom.com
Menu (ESC)

C82500 Copper vs. CC381H Copper-nickel

Both C82500 copper and CC381H copper-nickel are copper alloys. They have 68% of their average alloy composition in common. There are 27 material properties with values for both materials. Properties with values for just one material (2, in this case) are not shown.

For each property being compared, the top bar is C82500 copper and the bottom bar is CC381H copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
140
Elongation at Break, % 1.0 to 20
20
Poisson's Ratio 0.33
0.33
Shear Modulus, GPa 45
52
Tensile Strength: Ultimate (UTS), MPa 550 to 1100
380
Tensile Strength: Yield (Proof), MPa 310 to 980
140

Thermal Properties

Latent Heat of Fusion, J/g 240
240
Maximum Temperature: Mechanical, °C 280
260
Melting Completion (Liquidus), °C 980
1180
Melting Onset (Solidus), °C 860
1120
Specific Heat Capacity, J/kg-K 390
410
Thermal Conductivity, W/m-K 130
30
Thermal Expansion, µm/m-K 17
16

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 20
6.8
Electrical Conductivity: Equal Weight (Specific), % IACS 21
6.9

Otherwise Unclassified Properties

Density, g/cm3 8.8
8.9
Embodied Carbon, kg CO2/kg material 10
5.0
Embodied Energy, MJ/kg 160
73
Embodied Water, L/kg 310
280

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 11 to 94
60
Resilience: Unit (Modulus of Resilience), kJ/m3 400 to 4000
68
Stiffness to Weight: Axial, points 7.7
8.6
Stiffness to Weight: Bending, points 19
19
Strength to Weight: Axial, points 18 to 35
12
Strength to Weight: Bending, points 17 to 27
13
Thermal Diffusivity, mm2/s 38
8.4
Thermal Shock Resistance, points 19 to 38
13

Alloy Composition

Aluminum (Al), % 0 to 0.15
0 to 0.010
Beryllium (Be), % 1.9 to 2.3
0
Carbon (C), % 0
0 to 0.030
Chromium (Cr), % 0 to 0.1
0
Cobalt (Co), % 0.15 to 0.7
0
Copper (Cu), % 95.3 to 97.8
64.5 to 69.9
Iron (Fe), % 0 to 0.25
0.5 to 1.5
Lead (Pb), % 0 to 0.020
0 to 0.030
Manganese (Mn), % 0
0.6 to 1.2
Nickel (Ni), % 0 to 0.2
29 to 31
Phosphorus (P), % 0
0 to 0.010
Silicon (Si), % 0.2 to 0.35
0 to 0.1
Sulfur (S), % 0
0 to 0.010
Tin (Sn), % 0 to 0.1
0
Titanium (Ti), % 0 to 0.12
0
Zinc (Zn), % 0 to 0.1
0 to 0.5
Residuals, % 0 to 0.5
0